La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
This model uses the Semiconductor and RF modules to describe a photoconductive antenna (PCA). A laser pulse is applied on the surface of undoped LT-GaAs to generate electron-hole-pairs, which move under the influence of an external E-field creating a transient electric current pulse. ... En savoir plus
The model shows how to estimate the Young's modulus and Poisson ratio based on a tensile test. The test measures the tensile force and the radial displacement for different values of the prescribed displacement. The model is based on synthetic data generated in the model itself. It is ... En savoir plus
The model includes a compilation of benchmark examples included in the text book: Shape Memory Alloys: Modeling and Engineering Applications. D. Lagoudas Ed. Springer 2008. The model uses the Souza–Auricchio model and shows the thermomechanical properties of a NiTi alloy sample ... En savoir plus
In a MESFET, the gate forms a rectifying junction that controls the opening of the channel by varying the depletion width of the junction. In this model we simulate the response of a n-doped GaAs MESFET to different drain and gate voltages. For a n-doped material the electron ... En savoir plus
This model demonstrates the impact of convection and diffusion on the transport-limited electrodeposition of a copper microconnector bump (metal post). Microconnector bumps are used in various types of electronic applications for interconnecting components, for instance liquid crystal ... En savoir plus
This model presents a method to analyze acoustic damping pads. These pads use a constrained layer of viscoelastic material to dissipate energy and thus reduce the energy radiated as noise. Damping pads are used in many different industries to reduce the noise generated by vibrating ... En savoir plus
Walking instability, due to non-uniform distribution of clothes, is a common problem in lightweight portable washing machines. This problem is more severe in horizontal-axis washing machines, which are more popular because of their high efficiency in spite of high manufacturing cost. ... En savoir plus
This example is an adaptation of our DC Characteristics of a MOS Transistor (MOSFET) model where the metal and dielectric domains are modeled explicitly and not via a boundary condition. Therefore, the potential profile inside the metal and the insulator can be observed. En savoir plus
This app demonstrates the following: Using the knob form object Updating the geometry by rotating a knob Provides info if the results are above or below certain critical values Many trucks are equipped with cranes for handling loads and such cranes have a number of hydraulic ... En savoir plus
Some conventional three-port power dividers are resistive power dividers and T-junction power dividers. Such dividers are either lossy or not matched to the system reference impedance at all ports. In addition, isolation between two coupled ports is not guaranteed. The Wilkinson power ... En savoir plus