3D Modeling and Simulation of the Electromagnetic and Thermal Properties of Microwave and Millimeter Wave Electronics Packages

J. Ding, and D. Linton
Queen’s University, Belfast

The COMSOL Multiphysics package has been used in this work to model and simulate the electromagnetic and thermal properties of GaAs pHEMT based Monolithic Microwave Integrated Circuits (MMIC), and a multi-chip millimeter wave package including a Low Temperature Co-fired Ceramic (LTCC) antenna array.

Embedded shielding ground planes inside the ceramic and silicon carriers have been studied. The temperature increase of each component due to the self heating of the power devices in the packages was simulated by being coupled to the static electromagnetic analysis.