Technical Papers and Presentations

Ici vous trouverez les présentations issues des Conférences COMSOL à travers le monde. Réalisées par des utilisateurs de COMSOL Multiphysics, ces présentations explorent tous les domaines actuels d'innovation. Les applications couvrent pratiquement tous les secteurs industriels et impliquent des phénomènes électriques, mécaniques, fluidiques et chimiques. Utilisez la recherche rapide pour trouver les présentations les plus intéressantes dans votre domaine d'intérêt.

Influence of Geometry on Mixing in a Passive Micromixer

E. Giuri, A. Ricci, and C. Ricciardi
Laboratorio di Technologie Elettrobiochimiche Miniaturizzate per l'Anilisi e la Ricerca, Politechnico di Torino

Finite Element Method simulations of microstructure behaviour is carried out by COMSOL. This enables us to make also technological considerations related to the easy way of fabrication and to lower production costs as explained in the following slide.

Simulation of Electromagnetic Stirrers and Brakes Applied in the Metallurgical Field

C. Mapelli
Politecnico di Milano

The control of the flux within continuous casting systems used in the metallurgical field can be obtained through the application of electromagnetic. The model here has been solved through a linear time-harmonic solver. The results of the electromagnetic model have then been applied to the fluid-mechanics model through volume Lorentz forces.

Simulation of the Inverse Extrusion of Brass Rod by the Coupling of Fluid Mechanical, Thermal and ALE Modes

C. Mapelli, and L. Bergami
Dipartimento di Meccanica, Politecnico di Milano

The complete coupling among the Incompressible Navier-Stokes - General Heat Transfer -ALE modes can be a reliable tool for the simulation of the plastic deformation process. This is shown here.

Combined Transfer Phenomena in 3D Modeling of Packaged Foods

M.V. De Bonis[1,2], G. Altieri[2], and G. Ruocco[1,2]
[1] CFDfood
[2] DITEC, Università degli studi della Basilicata, Potenza

Heat and mass transfer can be analyzed for conditions that may limit shelf-life. With this target, the purpose of the present work is the development of a general model which is applicable to a large variety of packaging configurations, food products and environmental conditions. To this end, COMSOL Multiphysics is exploited in a full 3D geometry.

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