IEMN, Institut d’Electronique, de Microélectronique et de Nanotechnologie, UMR CNRS 8520, USTL Université des Sciences et Technologies de Lille, Villeneuve d’Ascq, France
The BioMEMS (Bio-Electro-Mechanical Systems) have become of considerable interest because they constitute a converging solution for many pluridisciplinary studies. The different covered fields are the biology (single cell, proteins, enzymes, neurons…), the chemistry (polymers), microelectronics and the microtechnologies associated with. Devices whose aim is the study of biological entities are ...
N.N. Sharma, and A. Tekawade
Mechanical Engineering Group, Birla Institute of Technology & Science, Pilani, Rajasthan, India
A simple design for a microfluidic flow system for use in mixing or reacting assays with limited sample availability has been proposed and analyzed using COMSOL\'s multiphysics simulation package. The design is based on differential electroosmotic flow concept which has facilitated a number of interesting flow phenomena in micro-domains. For an average potential drop of about 86 kV/m in the ...
G. Zhu, and Y. Li
Lawrence Technological University, Southfield, MI, USA
Fluids used in biomedical microelectromechanical systems (BioMEMS) devices often exhibit very different flow behavior from those in bulk solutions, which in turn affects the behavior of cells and biomolecules in the device. In this work, we investigate an integrated microfluidic system for living cell culture and assay. The system can be used as a generic platform to study the behavior of ...
Narovlyansky, M.1, Squires, T.M.2, Whitesides, G.M.1
1 Department of Chemistry and Chemical Biology, Harvard University, Cambridge, MA, U.S.A.
2 Departments of Physics and Applied Mathematics, Caltech, Pasadena, CA
In electrokinetic separations, the narrower and more homogeneous the initial sample plug, the higher the ultimate resolution of the separation. Here we describe a general and versatile method to sculpt low-dispersion, high-fidelity sample zones in microfluidic devices for high resolution electrokinetic separations. In a simple channel intersections microfabricated partitions act to reduce each ...
B. Ottosson, Y. Jouahri, C. Rusu, and P. Enoksson
Imego AB, Gothenburg, Sweden
Chalmers University of Technology, Gothenburg, Sweden
The objective of this work has been to realize a feasibility study of a cooling device for a SQUID sensor using liquid nitrogen flowing through micro channels. The design consists of an epoxy cylindrical vacuum vessel skewed by a silicon microchannel heat sink. The SQUID sensor is situated directly on top of the microchannel heat sink. The device is used at room temperature and should be able to ...
A. K. Namdeo, N. Ramakrishna, H. B. Nemade[1,2], and R. P. Palathinkal
 Department of Electronics and Communication Engineering, Indian Institute of Technology Guwahati, Assam, India
 Centre for Nanotechnology. Indian Institute of Technology Guwahati, Assam, India
In this paper a finite element method(FEM) study of a surface acoustic wave (SAW)device excited by electrostatic coupling method is performed by using COMSOL Multiphysics. We have modeled a Rayleigh wave type SAW device by choosing YZ Lithium niobate as the substrate. The effect of external radio frequency (RF) field to the SAW device is analyzed. The effect of distance between the contactless ...
A. Auge, A. Weddemann, F. Wittbracht, B. Vogel, and A. Hütten
Department of Physics, Thin Films and Physics of Nanostructures, Bielefeld University, Bielefeld, Germany
The oxidation behavior of metallic nanoparticles is investigated in respect to material parameters like Mott potential, defects on the microstructure and oxide volume increase per ionic defect. An emphasis is laid on magnetic nanoparticles where the degree of oxidation can be measured via the reduction of the magnetic moment.
G.S. Durante and M. Fretz
CSEM Zentralschweiz, Alpnach Dorf, Switzerland
Flip-chip interconnection technologies have been tested through the use of a test chip with embedded single-bump daisy chains. The Flip-Chip technologies are selected among Au bump Thermocompression (TC) with and without Nonconductive Adhesives (NCA) underfiller, anisotropic conductive adhesive (ACA) bonding, and AuSn20 eutectic solder. The single bumps were then measured with a high precision ...
Viscous damping of a periodic perforated MEMS microstructure when the Reynolds’ equation cannot be applied: Numerical simulations
D. Homentcovschi, and R.N. Miles
Department of Mechanical Engineering, SUNY Binghamton, NY
This paper develops a computational model for determining the total damping coefficient for a unit cell of a MEMS microscale device containing a repetitive pattern of holes. The basic cell of the microstructure is approximated by an axi-symmetric domain and the velocity and pressure fields are determined from solutions of the Navier-Stokes equations using the finite element software package ...
M. Itomlenskis, P. Fodor, and M. Kaufman
Physics Department, Cleveland State University, Cleveland, OH, USA
Relief patterning of the surface of microchannels has been actively pursued as a method of promoting mixing in systems with a low Reynold’s number (<<100). In this work, we explore, by using the COMSOL Multiphysics package and its Chemical Engineering Module, the possibility of enhancing the mixing quality of two fluids in a microchannel with a non-periodic fractal pattern of ridges ...