Technical Papers and Presentations

Ici vous trouverez les présentations issues des Conférences COMSOL à travers le monde. Réalisées par des utilisateurs de COMSOL Multiphysics, ces présentations explorent tous les domaines actuels d'innovation. Les applications couvrent pratiquement tous les secteurs industriels et impliquent des phénomènes électriques, mécaniques, fluidiques et chimiques. Utilisez la recherche rapide pour trouver les présentations les plus intéressantes dans votre domaine d'intérêt.

Heat Transfer Model for Embedded Thermocouple in Firefighter Glove

D. Mrugala, T. Riebeck, and W. Lang
Institute for Microsensors, -actuators and –systems (IMSAS)
University of Bremen
Bremen, Germany

The Integration of contact heat measurement with intelligent fire fighter gloves assumes parametric simulations with the heat transfer module of COMSOL. A thermocouple is embedded into high temperature protective layers of the glove and measures contact heat. This is done by by pressing the hand backside of the glove against a hot device like a door. The Heat transfer module has been used to ...

La5Ca9Cu24O41 Layers as 1D Heat Spreaders for Thermal Management Solutions

C. Orfanidou, and J. Giapintzakis
Department of Mechanical and Manufacturing Engineering
University of Cyprus
Nicosia, Cyprus

This paper deals with the design of a viable thermal management solution using La5Ca9Cu24O41 layers for heat channeling. The simulations are carried out with the finite element method using COMSOL Multiphysics Heat Transfer Module. COMSOL 4.2 was used to model and optimize silicon devices. Malfunctioning elements on silicon devices are sometimes converted into hotspots resulting in the ...

Numerical Experiments for Thermally-induced Bending of Nematic Elastomers with Hybrid Alignment

L. Teresi[1], and A. DeSimone[2]
[1]LaMS - Modeling & Simulation Lab, University Roma Tre, Roma, Italy
[2]SISSA - International School for Advanced Studies, Trieste, Italy

We deal with Liquid Crystal Elastomers (LCEs) having hybrid alignment (HNEs), that is, fabricated with a given non-homogeneous nematic orientation. For such a materials, permanent distortions induced by deswelling can be compensated by those resulting from cooling below the transition temperature, thus yielding the possibility of producing temperature-driven actuators. Here, we simulate the ...

Current Density, Electric Field and AC Loss Simulation of Mono Block and Single Layer Polygonal HTS Cable Using COMSOL Multiphysics

G. Konar[2], R. K. Mandal[1], and N. Chakraborty[2]
[1]Electrical Engineering Department, Seacom Engineering College, Dhulagar,West Bengal, India
[2]Power Engineering Department, Jadavpur University, Kolkata, West Bengal, India

High temperature super conducting (HTS) cables are gaining attentions for their ability to transmit more power compared to their convention counterparts with essentially no resistance and electromagnetic emissions. They are also appropriate for solving the grid congestion problem in the power corridors with their reduced size and weight. But the AC loss that occurs in the HTS cables reduces the ...

Single Crystal Diamond NEMS Switch

M. Liao
Optical and Electronic Materials Unit
National Institute for Materials Science
Japan

A single-crystal diamond NEMS switch was fabricated while batch production of SCD MEMS/NEMS structures were developed. The diamond NEMS switches exhibit high performance with respect to high controllability, high reproducibility, and good reliability. Modeling and simulations were made that were consistent with experiments.

Drug Distribution in the Human Eye

L. Murtomäki[1], T. Kainuvaara[1]
[1]University of Helsinki, Helsinki, Finland

Drug therapy of the posterior segment of an eye is very challenging due to the difficult accessibility. Modern drugs often are large molecules, such as peptides, antibodies or oligonucleotides which are administrated, e.g. by intravitreous injections which requires clinical conditions. Computer modeling can be helpful in designing new and less invasive routes of drug administration. COMSOL is ...

Numerical Aspects of the Implementation of Artificial Boundary Conditions for Laminar Fluid-Structure Interactions

C. Boeckle[1], P. Wittwer[1]
[1]University of Geneva, Geneva, Switzerland

We discuss the implementation of artificial boundary conditions for stationary Navier-Stokes flows past bodies in the half-plane, for a range of low Reynolds numbers. When truncating the half-plane to a finite domain for numerical purposes, artificial boundaries appear. We present an explicit Dirichlet condition for the velocity at these boundaries in terms of an asymptotic expansion for the ...

Coupled Heat and Moisture Transfer in Building Components - Implementing WUFI® Approaches in COMSOL Multiphysics

B. Nusser[1], M. Teibinger[1]
[1]Holzforschung Austria, Vienna, Austria

Calculating time-dependent heat and moisture transports trough building components are important tasks in the area of building physics. A well known and worldwide used commercial software for this is WUFI®. From the scientific point of view the restricted access to governing equations is nevertheless a drawback of this software. In the present paper it is shown how the physical approaches used ...

Building Energy Simulation Using the Finite Element Method

J. van Schijndel[1]
[1]Eindhoven University of Technology, Eindhoven, The Netherlands

In order to predict, improve and meet a certain set of performance requirements related to the indoor climate of buildings and the associated energy demand, building energy simulation (BES) tools are indispensable. Due to the rapid development of FEM software and the Multiphysics approaches, it should possible to build and simulate full 3D models of buildings regarding the energy demand. The ...

Evaluation of Low-Cycle-Fatigue Life of Solder Joints in Surface Mounting Power Devices by Finite Element Modeling

N. Delmonte[1], F. Giuliani[1], M. Bernardoni[2], P. Cova[1]
[1]Dipartimento di Ingegneria dell'Informazione, Università degli Studi di Parma, Parma, Italy
[2]CDTR - Centre for Device Thermography and Reliability, H. H. Wills Dept. of Physics, University of Bristol, Bristol, United Kingdom

The reliability of solder joints [1,2] is one of the key factors in the determination of the reliability of the high power density electronic converters, being the solder joints both the mechanical, the electrical, and often the thermal connections between the electronic component and the board in which the component is placed. The main mechanism by which solder joints are damaged is thermal ...

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