Image Gallery

Welcome to the COMSOL Image Gallery. The simulation images on this page are available for editors and journalists to use in appropriate articles. The phrase "Image made using COMSOL Multiphysics® software and provided courtesy of COMSOL." must appear in the vicinity of every image or at the bottom of the article.

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Electrodeposition Module

Electrodeposition Factory Floor

Electrodeposition Factory Floor

Factory floor with a series of reel-to-reel electroplating units. As reels of solid or stamped metal plates pass through the electroplating units, metal is deposited over the entire plate or sections of the plate according to the application of electric current and the placement of shields. By using COMSOL simulation software, savings of between 10% and 30% of the metal deposited during electrolysis have been achieved. Picture courtesy of Philippe Gendre, PEM, France.

Electrodeposition Simulation

Electrodeposition Simulation

An electrodeposition simulation for predicting the thickness of the decorative deposited layer in a furniture fitting. The Electrodeposition Module computes the layer thickness, here on the order of micrometers, using a secondary current distribution model and a deposit thickness variable at each point on the surface.

Copper Deposition Simulation

Copper Deposition Simulation

This model of copper deposition in a trench-like geometry illustrates the use of moving meshes in accounting for the relatively large changes in geometry as electrodeposition of copper takes place on a cathode surface. Both electrode kinetics and transport by diffusion and convection of ions are accounted for, and the model is therefore referred to as a tertiary current density distribution model.