Yeswanth Rao, Conference Program Chair
COMSOL, Inc. firstname.lastname@example.org
Call for Papers: COMSOL Conference 2009 Boston
BOSTON (March 30, 2009) — COMSOL, Inc., will hold its fifth annual North American conference on multiphysics modeling and simulation October 8-10 at the Boston Marriott Newton. Engineers, researchers, scientists, educators and students are invited to submit abstracts describing their innovative use of COMSOL Multiphysics® software. Authors of accepted submissions will present their work at the conference and submit a paper for the conference proceedings. Last year, more than 100,000 CDs of the 2008 COMSOL Conference Proceedings were distributed to multiphysics users worldwide.
Technical paper submissions covering a broad range of multiphysics applications should complement the main conference themes:
* Bioscience and Bioengineering
* Earth Science
* Fluid dynamics
* Fluid-Structure Interactions
* Fuel Cells and Electrochemistry
* Fundamental Studies, Optimization & Numerical Methods
* Heat transfer & Thermo-Mechanics
* Materials Science & Nanotechnology
* MEMS and Microfluidics
* Plasma Physics, EHD and MHD
* Porous Media Flow
* Process & Chemical Engineering
* Quantum Mechanics
* Reaction Engineering and Reactor Design
* Semiconductor Devices
* Structural Mechanics
* Transport Phenomena
Abstracts should briefly (200 - 400 words) summarize the individual’s or group’s work, with particular emphasis on describing the problem, solution, results, and conclusions. Abstracts must provide the corresponding author’s full contact information as well as the names and affiliations of all contributing authors.
Abstracts submitted by the early bird deadline of June 26th will receive a $100 discount on conference registration fees. The final deadline for the submission of abstracts is August 7th. Interested parties should visit http://www.comsol.com/conference2009/usa/papers/ for complete guidelines on submitting and uploading an abstract.
For more information on the COMSOL Conference Boston 2009, visit http://www.comsol.com/conference2009/usa/.
About the COMSOL product line
COMSOL Multiphysics is a scientific-software environment for the modeling and simulation of any physics-based system. A particular strength is its ability to account for multiphysics phenomena. Optional modules add discipline-specific tools for chemical engineering, earth science, electromagnetics, heat transfer, MEMS, and structural mechanics. Another key product is COMSOL Reaction Engineering Lab®, which allows users to model reacting systems. The COMSOL products are available for the Windows, Linux, Solaris, and the Macintosh operating systems. Full details about COMSOL Multiphysics and related products are available at www.comsol.com.
About the COMSOL Group
COMSOL was founded in 1986 in Stockholm, Sweden, and has grown to include offices in the Benelux, Denmark, Finland, France, Germany, India, Italy, Norway, Switzerland, the United Kingdom, and a US presence with offices in Burlington, MA, Los Angeles, CA, and Palo Alto, CA. Additional information about the company is available at www.comsol.com.
COMSOL, COMSOL Multiphysics, COMSOL Reaction Engineering Lab and FEMLAB are registered trademarks of COMSOL AB. Other products or brand names are trademarks or registered trademarks of their respective holders.