Studying Manifold Microchannel Heat Sinks with Simulation
May 16, 2016
When an electronic device overheats, it risks starting a fire. Cooling components, such as heat sinks, are designed to prevent this, but can’t always keep up with advancing technology. Simulation offers a solution by illustrating how well various heat sink designs conduct heat and how adding elements like manifold microchannels (MMC) improves performance. Today, we’ll explore how an MMC heat sink operates with simulation.
