Z. Huang, and P. Conway
Wolfson School of Mechanical and Manufacturing Engineering
This paper presents models of microstructures using COMSOL Multiphysics. In particular, solder joints and bumps are investigated and diffusion of species from the substrate to the interface.
Self Heating Effects and Equilibrium Rise Times within Micro Silicon Thermistors Operating Within a Gas Liquid Interface
R.Osborne, and K. Dawkins
University of Birmingham
This paper considers the thermal behaviour of an array of micro-silicon thermistors operating within a liquid/gas interface for fluid level sensing applications. COMSOL Multiphysics has been used to model and simulate the transient multiphysics model and calculate the overall thermal flux, the steady-state condition and time taken to obtain steady thermal balance.
T.J. Craven, J.M. Rees, and W.B. Zimmerman
University of Sheffield
The Oldroyd-B family of viscoelastic fluids are notoriously difficult to model numerically. Standard Galerkin finite element methods are prone to numerical oscillations, and solutions break down as fluid elasticity increases. The situation can be remedied to a certain degree however through the addition of weak stabilisation terms to the Galerkin formulation. We present a stabilised ...