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reply 1 decade ago by Ivar KJELBERG
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Version 4.0a Acoustics & VibrationsStructural Mechanics reply 1 decade ago by Ivar KJELBERG
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How can i model semiconductor and its packaging in Comsol using CAD and test under electrical, mechnical and thermal aspect.
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reply 1 decade ago by Usman Khan
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Version 4.0a reply 1 decade ago by Edgar Kaiser
 
