La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
This example demonstrates how to model coupled flow, heat transfer, and structural deformation and stress in a pipeline network. Gravity loads from the pipe and fluid are also taken into account. En savoir plus
This app demonstrates the following: Geometry parts and parameterized geometries Sending an email with a report when the computation is finished User-defined email server settings which is useful when running compiled standalone applications Options for setting different mesh sizes ... En savoir plus
Thermal management has become a critical aspect of today’s electronic systems, which often include many high-performance circuits that dissipate large amounts of heat. Many of these components require efficient cooling to prevent overheating. Some of these components, such as processors, ... En savoir plus
This model is intended as a first introduction to simulations of fluid flow and conjugate heat transfer. It shows you how to: Draw an air box around a device in order to model convective cooling in this box, set a total heat flux on a boundary using automatic area computation, and ... En savoir plus
This tutorial model uses a heat sink geometry from the Part Library. The tutorial shows different approaches to heat transfer modeling when studying the cooling of an electronic chip. In the first part, only the solid parts are modeled, while the convective airflow is modeled using ... En savoir plus
This study simulates the thermal behavior of a computer Power Supply Unit (PSU). Most of such electronic enclosures include cooling devices to avoid electronic components to be damaged by excessively high temperatures. In this model, an extracting fan and a perforated grille cause an air ... En savoir plus
This example computes the effectiveness of a porous microchannel heat sink over a conventional microchannel heat sink. The model is fully parameterized. A parameter study on the thickness of the porous substrate is used to determine the optimal configuration. En savoir plus
The inductor is a common component in a variety of electrical devices. Its applications include power transformation and measurements, and it can also be used together with capacitors to create oscillators. In small devices with many components, such as in laptops, heat generation can ... En savoir plus
This app demonstrates the following: Geometry parts and parameterized geometry A results table form object containing outputs Finned pipes are used for coolers, heaters, or heat exchangers to increase heat transfer. They come in different sizes and designs depending on the ... En savoir plus
This example models the transient heating, and final temperature, of a disc brake of a car in brake-and-release sequence. It is important to model the transient heating and the following convective cooling to determine the minimum interval between a series of similar brake engagements. ... En savoir plus