La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
Secondary Current Distribution in a Zinc Electrowinning Cell
This is a model of the secondary current distribution in a zinc electrowinning cell. The model investigates the impact on the current distribution when changing the electrode alignment in a parametric study. The geometry is in 2D. En savoir plus
Ion-Exchange Membranes and Donnan Potentials
This model file was used for creating the plots featured in the blog post "How to Model Ion-Exchange Membranes and Donnan Potentials". En savoir plus
Aluminum Anodization
When anodizing aluminum, the surface is electrochemically altered to form an abrasive and corrosion-resistive Al2O3 film. The electrode kinetics during the process are only marginally affected as the oxide layer grows, so a stationary analysis of the current distribution is sufficient to ... En savoir plus
Electrodeposition of a Microconnector Bump in 2D
This model demonstrates the impact of convection and diffusion on the transport-limited electrodeposition of a copper microconnector bump (metal post). Microconnector bumps are used in various types of electronic applications for interconnecting components, for instance liquid crystal ... En savoir plus
Decorative Plating
Tutorial model of electroplating. The model uses secondary current distribution with full Butler-Volmer kinetics for both anode and cathode. The thickness of the deposited layer at the cathode is computed as well as the pattern caused by dissolution of the anode surface. En savoir plus
Electroplating of Multiple Components in a Rack
When several components are to be electroplated they are typically mounted on a rack in the electroplating bath. An important aspect is then achieving a uniform thickness of the plated layer for all components mounted on the rack. This example model allows for investigating the effect ... En savoir plus
Electrodeposition on a Resistive Patterned Wafer
This example models time-dependent copper deposition on a resistive wafer in a cupplater reactor. As the deposited layer builds up, the resistive losses of the deposited layer decreases. The benefit of using a current thief for a more uniform deposit is demonstrated. En savoir plus
Potential Profile in Batteries and Electrochemical Cells
The purpose of this model is to visualize the electric potential in an electrochemical cell, for example a battery. This is done at OCV and during operation. In a battery, this would correspond to OCV, discharge, and recharge. The potential profile is explained both for cells with planar ... En savoir plus
Rotating Cylinder Hull Cell
Rotating cylinder Hull cells are an important experimental tool in electroplating and electrodeposition and are used for the measurement of nonuniform current distribution, mass transport, and throwing power of plating baths. The model reproduces the results for a commercially available ... En savoir plus
Electrodeposition of an Inductor Coil
This example models the deposition of an inductor coil in 3D. The geometry includes the extrusion of the deposition pattern into an isolating photoresist mask, and a diffusion layer on top of the photoresist. The mass transfer of copper ions in the electrolyte has a major impact on the ... En savoir plus