La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
Thermal Management of a Battery Pack Using a Phase Change Material
Thermal management of a battery pack is simulated considering two scenarios, air (natural convection) and phase change material (PCM) in the gap between the batteries. The PCM considered is a composite material of paraffin wax and graphite additive. Graphite is typically added for ... En savoir plus
Heat Transfer in a Room with a Stove
This model represents a stove in a living room. A radiation study is performed with the Surface-to-Surface Radiation physics interface. It shows the intensity of the stove radiation received on different surfaces of the room. En savoir plus
Power Transistor
In every system where there is conduction of electric current, and where the conductivity of the material is finite, there will be electric heating. Electric heating, also referred to as Joule heating, is in many cases an undesired by-product of current conduction. This model simulates a ... En savoir plus
Thermal Contact Resistance Between an Electronic Package and a Heat Sink
This example reproduces parts of the study of Ref. 1 on the thermal contact resistance at the interface between a heat sink and an electronic package. Eight cooling fins equip the cylindrical heat sink and contact is made at the radial boundaries of the package. The efficiency of the ... En savoir plus
LED Bulb Cooling
This model describes the three heat transfer modes: conduction, convection, and radiation, combined with nonisothermal flow in a realistic geometry representing a light bulb and the surrounding air. The LED chips dissipate heat. The model computes the equilibrium temperature induced by ... En savoir plus
Thermal-Stress Analysis of a Turbine Stator Blade
This example shows how to compute thermally induced stresses in a turbine stator blade using the Thermal Stress, Solid interface. The conditions within gas turbines are extreme. The pressure can be as high as 40 bar, and the temperature more than 1000 K. Any new component must therefore ... En savoir plus
Modeling Laser Beam Absorption in Silica Glass with Beer-Lambert Law
This tutorial shows how to use the Radiative Beam in Absorbing Media interface (Heat Transfer Module) to model the attenuation of a laser light going through a sample of silica glass, and the heat source generated by the absorption. En savoir plus
Condensation Risk in a Wood-Frame Wall
This 2D stationary model computes heat and moisture transport in a wall composed of different hygroscopic materials. A comparison with the Glaser method is given for the temperature and relative humidity solutions. The effect of the use of a vapor barrier is also investigated. En savoir plus
Heat Transfer in a Surface-Mount Package for a Silicon Chip
All integrated circuits (ICs) — especially high-speed devices — produce heat. In today’s dense electronic system layouts, heat sources are many times placed close to heat-sensitive ICs. Designers of printed circuit boards often need to consider the relative placement of heat ... En savoir plus
Topology Optimization of a Heat Exchanger with Laminar Flow
This model demonstrates topology optimization of a 2D heat exchanger with laminar flow. The flow is pressure driven and the objective is to maximize the heat transfer. The density method is used with the (now) classical approach of a single design variable and two flow interfaces. ... En savoir plus