La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
Reflow soldering is an important process in IC packaging. In reflow soldering, the solder materials are melted to create joints between electrical components and the PCBs for structural and electrical connections. This model demonstrates the process of attaching chips to a PCB by reflow ... En savoir plus
In this example, a benchmark problem in dynamic fracture of brittle materials is analyzed using the AT1 phase-field damage model. An instantaneous tensile load is applied to a planar tension specimen with a pre-existing crack. Initially, the crack propagates perpendicular to the loading ... En savoir plus
This model demonstrates the inflation of a rubber balloon with four different hyperelastic material models. The results are compared with the analytical solution for a thin-walled, spherical vessel. Controlling the inflation of hyperelastic balloons is important in clinical ... En savoir plus
This example shows how to implement a stress dependent material model. The Young's modulus changes based on the stress value. En savoir plus
Micromirrors are used in certain MEMS devices to control optic elements. This model of a vibrating micromirror surrounded by air uses the Thermoacoustic-Shell Interaction user interface to model the fluid-solid interaction, and it thus includes the correct viscous and thermal damping of ... En savoir plus
This model shows how to use the scattered field formulation to compute the transmission coefficient for impinging P and S plane elastic waves onto a finite size phononic crystal. The transmission tends to zero in the frequency range corresponding to P- and S-wave band gaps, as ... En savoir plus
Modern integrated circuits are available as plastic encapsulated microcircuits (PEM). These devices are molded out of polymeric materials and epoxy resins in order to protect the internal semiconductors. Unfortunately, polymeric mold compounds absorb moisture when exposed to a humid ... En savoir plus
Layered shell elements, which are used for modeling composite shells, often connected to solid and shell elements in cladding or side-by-side configuration to represent a realistic structure. For such applications, it becomes important to connect layered shell element correctly and ... En savoir plus
This example studies viscoplastic creep in solder joints under thermal loading using the Anand viscoplasticity model, which is suitable for large, isotropic, viscoplastic deformations in combination with small elastic deformations. The geometry includes two electronic components (chips) ... En savoir plus
Predicting the noise radiation from a dynamic system gives designers insight into the behavior of moving mechanisms early in the design process. For example, consider a gearbox in which the change in the gear mesh stiffness causes vibrations. These vibrations are transmitted to the ... En savoir plus