La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
This tutorial model demonstrates the use of the multiphysics coupling feature Thermal Connection, Layered Shell, Surfaces. In this model, one layered shell is connected to heat domains by a facing boundary. The results obtained with the Heat Transfer in Shells interface are compared with ... En savoir plus
This tutorial model demonstrates the use of the multiphysics coupling feature Thermal Connection, Layered Shell, Surfaces. In this model, three layered shells are connected to heat domains by interior and exterior boundaries. The results obtained with the Heat Transfer in Shells ... En savoir plus
This example model consists of a two-hot-arm thermal actuator made of polysilicon. The actuator is activated through thermal expansion. The temperature increase required to deform the arms, and thus displace the actuator, is obtained through Joule heating (resistive heating). The greater ... En savoir plus
This model analyzes the thermal expansion in a MEMS device, such as a microgyroscope, where thermal expansion should be minimized. The device is made from the copper-beryllium alloy UNS C17500 and uses temperature-dependent material properties from the Material Library. The purpose of ... En savoir plus
The thermal stress in a layered plate is studied in this example. A plate consisting of two layers, a coating and a substrate layer, is stress and strain free at 800 degrees C. The temperature of the plate is reduced to 150 degrees C and thermal stresses are induced due to the difference ... En savoir plus
This model demonstrates how to couple the Semiconductor interface to the Heat Transfer in Solids interface. A thermal analysis is performed on the existing bipolar transistor model in the case when the device is operated in the active-forward configuration. The Semiconductor interface ... En savoir plus
This tutorial model of a two-hot-arm thermal actuator couples three different physics phenomena: electric current conduction, heat conduction with heat generation, and structural stresses and strains due to thermal expansion. The model exists in three versions: Joule Heating of a ... En savoir plus
This example shows how to set up multiple sandwiched thin layers with different thermal conductivities in two different ways. First, the composite is modeled as a 3D object. In the second approach, the thin domains are modeled with thermal resistors in the Lumped Thermal System ... En savoir plus
Thermal management has become a critical aspect of today’s electronic systems, which often include many high-performance circuits that dissipate large amounts of heat. Many of these components require efficient cooling to prevent overheating. Some of these components, such as processors, ... En savoir plus
Microwave filters are used to eliminate unwanted frequency components in the output from microwave transmitters. They are typically inserted between a power amplifier and an antenna. The amplifiers are nonlinear and produce harmonics that must be eliminated with filters that have a ... En savoir plus