La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
This tutorial demonstrates how to set up a simple static structural analysis. The analysis is exemplified on a combination wrench during the application of torque on a bolt. Despite its simplicity, and the fact that very few engineers would run a structural analysis before trying to turn ... En savoir plus
A gate-all-around MOSFET consists of a nanowire with a gate electrode wrapped around the circumference. Since the entire nanowire forms the channel, this configuration provides the best possible electrostatic control of the channel and offers a good candidate for the miniaturization of ... En savoir plus
Recent advances in the fabrication of microfluidic systems require handling of live cells and other micro particles as well as mixing. All this can, for example, be achieved using acoustic radiation forces and the viscous drag from the streaming flow. Streaming: Due to the nonlinear ... En savoir plus
There are multiple ways to excite and terminate transmission lines using different types of port and lumped port features. In this example, transverse electromagnetic (TEM) type ports and a via type lumped port are used to simulate two adjacent microstrip lines. One via end is terminated ... En savoir plus
This is a model of an RF waveguide bend with a dielectric block inside. There are electromagnetic losses in the block as well as on the waveguide walls which cause the assembly to heat up over time. The material properties of the block are functions of temperature. The transient thermal ... En savoir plus
The thermal stress in a layered plate is studied in this example. A plate consisting of two layers, a coating and a substrate layer, is stress and strain free at 800 degrees C. The temperature of the plate is reduced to 150 degrees C and thermal stresses are induced due to the difference ... En savoir plus
This models pressure-dependent heating of 4 inch wafer on unipolar electrostatic chuck. Wafer sits on top of ring with electrostatic force holdong down wafer to counter upward pressure from gas flowing in gap between wafer and chuck surface. It is a problem involving 4 coupled physics ... En savoir plus
This example simulates electroplating of a printed circuit board (PCB) in 3D using the Secondary Current Distribution interface. In order to achieve thickness uniformity across the PCB, a dummy pattern is included in the design, along with an aperture in the electroplating bath. En savoir plus
In this model, two flat end mirrors are placed at a distance and a spherical lens is inserted in the middle of the cavity. A ray is released from a point inside the cavity. Then the ray is traced for a predefined time period that is sufficiently long. Ray tracing continues until the ... En savoir plus
This example shows how to use the Optimization Module to find a coil geometry giving a uniform magnetic field on axis and minimal field near the axis ends. En savoir plus