La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
In this set of eight tutorial models and associated documentation, you can investigate the resistive, capacitive, inductive, and thermal properties of a standard three-core lead-sheathed XLPE HVAC submarine cable with twisted magnetic armor (500 mm2, 220 kV). The series includes a 2D, 2D ... En savoir plus
Steel pipelines are often subjected to complex stress/strain conditions in the oil and gas industry. Additionally, pipes are subjected to significant longitudinal strain due to soil movement. For the elastoplastic stress simulation, the Solid Mechanics interface is used with the small ... En savoir plus
One method of creating spring-like structures or inducing curvature in thin structures is to plate them to substrates that are under the influence of residual stresses. The plating process can control this stress even for similar materials. One such device is the electrostatically ... En savoir plus
In this example, a settlement and heave analysis of a shallow foundation resting on an unsaturated soil stratum is conducted with the Modified Cam-Clay and Extended Barcelona Basic soil models. The effect of pore suction due to movements in the phreatic line and the resulting settlement ... En savoir plus
This models pressure-dependent heating of 4 inch wafer on unipolar electrostatic chuck. Wafer sits on top of ring with electrostatic force holdong down wafer to counter upward pressure from gas flowing in gap between wafer and chuck surface. It is a problem involving 4 coupled physics ... En savoir plus
Microlithography lenses are used to project the image of an integrated circuit onto a silicon substrate. This tutorial demonstrates how to create a 21-element fused silica lens which has a NA of 0.56 which is designed to be used at a wavelength of 248nm. The lens, which has a total ... En savoir plus
The model includes a compilation of benchmark examples included in the text book: Shape Memory Alloys: Modeling and Engineering Applications. D. Lagoudas Ed. Springer 2008. The model uses the Souza–Auricchio model and shows the thermomechanical properties of a NiTi alloy sample ... En savoir plus
This 3D model example demonstrates the use of the Primary Current Distribution interface for modeling current distributions in electrochemical cells. In primary current distribution, the potential losses due to electrode kinetics and mass transport are assumed to be negligible, and ... En savoir plus
In this example, the Bergstrom–Boyce material model is used to capture the nonequilibrium behavior of carbon-black-filled chloroprene rubber under a strain history that alternates compression with relaxation. Results are verified against experimental and numerical results taken from ... En savoir plus
The thin low permittivity gap boundary condition is meant to approximate a thin layer of material with low relative permittivity compared to its surroundings. This boundary condition is available for electrostatic field modeling. This example compares the thin low permittivity gap ... En savoir plus
