La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
The purpose of this app is to understand EIS, Nyquist, and Bode plots. The app lets you vary the bulk concentration, diffusion coefficient, exchange current density, double layer capacitance, and the maximum and minimum frequency. Electrochemical impedance spectroscopy (EIS) is a common ... En savoir plus
Highly alloyed stainless steel used in chlorinated seawater systems may be prone to corrosion under certain operating conditions. Conventional cathodic protection technique is less suitable for stainless steel due to unacceptable anode consumption rate and propensity to hydrogen ... En savoir plus
This model analyzes the thermal expansion in a MEMS device, such as a microgyroscope, where thermal expansion should be minimized. The device is made from the copper-beryllium alloy UNS C17500 and uses temperature-dependent material properties from the Material Library. The purpose of ... En savoir plus
This example shows how to perform a fatigue analysis of a structure subjected to random vibrations. Times to failure using the cycle counting models according to Bendat and Dirlik are compared. En savoir plus
Silicon micromechanical resonators have long been used for designing sensors and are now becoming increasingly important as oscillators in the consumer electronics market. In this series of models, a surface micromachined MEMS resonator, designed as part of a micromechanical filter, is ... En savoir plus
An electrostatically actuated MEMS resonator is simulated in the time and frequency domains. The device is driven by an AC + DC bias voltage applied across a parallel plate capacitor. The dependence of the resonant frequency on DC bias is assessed, and frequency domain and pull-in ... En savoir plus
Through-silicon vias (TSVs) allow chips or wafers to be connected vertically, making TSV a crucial technology for 2.5D and 3D packaging. The basic structure of a TSV consists of a deep hole penetrating a silicon substrate, a filling metal (usually copper) in the deep hole, and an ... En savoir plus
This model shows that the frequency response, i.e., admittance curve, of the SAW unit cell with IDT is in good agreement with the series resonance & antiresonance frequencies obtained from the eigenfrequency studies in the tutorial Surface Acoustic Wave Velocity Calculations from a ... En savoir plus
