La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
Including circumferential displacements in a 2D axisymmetric Solid Mechanics interface allows to compute twist and bending deformations. This model determines stress concentration factors for a hollow shaft for load cases of axial extension, torsion, as well as bending, using a ... En savoir plus
The first model describes the simultaneous flow of two immiscible fluids in porous media - here air displaces water in a multi-step inlet pressure experiment. We solve for the pressure and the degree saturation for the air and water within a representative volume and so track saturation ... En savoir plus
Induced eddy currents and associated thermal loads is of interest in many high power AC applications. This example is of general nature and illustrates some of the involved physics as well as suitable modeling techniques in the AC/DC Module. In this model a metallic plate is placed ... En savoir plus
For slender structures, buckling is a catastrophic instability if the service load is above the critical limit. For such structures, it can be important to study the behavior of the structure beyond the critical buckling load, which is known as postbuckling analysis. Tracing the ... En savoir plus
Ion implantation is used extensively in the semiconductor industry to implant dopants into wafers. Within an ion implanter, ions generated within an ion source are accelerated by an electric field to achieve the desired implant energy. Ions of the correct charge state are selected by ... En savoir plus
This problem follows a typical preliminary board-level thermal analysis. First perform a simulation of the board with some Integrated Circuits (ICs). Then, add a disk-stack heat sink to observe cooling effects. Finally, explore adding a copper layer to the bottom of the board in order to ... En savoir plus
All integrated circuits (ICs) — especially high-speed devices — produce heat. In today’s dense electronic system layouts, heat sources are many times placed close to heat-sensitive ICs. Designers of printed circuit boards often need to consider the relative placement of heat ... En savoir plus
This app demonstrates the following: Multiple components (1D and 3D) in a single app Using the same choice list in the app as in the model using Data Access functionality Output numerical results for a specific time step using a combo box The app combines the Ray Optics Module and ... En savoir plus
This tutorial demonstrates how to model the interaction between an acoustic field and the heat release from a flame, using the Flame Model domain feature. Modeling this interaction is important in order to understand and predict unstable acoustic modes in gas turbines and jet engines. ... En savoir plus
This model analyzes the nonlinear transfer impedance of a tapered orifice that can be part of a perforate or microperforated plate (MPP). The analysis is carried out for various degrees of tapering of the perforate and for a frequency range. A linear analysis is set up in the frequency ... En savoir plus