La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
This example uses the thermal expansion of a laminated composite shell model to demonstrate the use of the feature Thermal Contact, Interface, applied on interfaces between layers in a laminated composite shell. The first study is computed neglecting this additional thermal resistance in ... En savoir plus
A 3D model of an acoustic trap in a glass capillary actuated by a piezoelectric transducer. The system is actuated by an oscillating electric potential across the piezoelectric transducer inducing mechanical vibrations in the solid and an acoustic pressure field in the fluid. The heat ... En savoir plus
In this example, a heterogeneous NMC (Nickel-Manganese-Cobalt) electrode structure is generated from tomography data using a Model Method. Time-dependent discharge and electrochemical impedance spectroscopy (EIS) simulations are then made on the full 3D geometry. A solid mechanics ... En savoir plus
In the semiconductor manufacturing process, photoresist coating is an important process and the thickness of the photoresist layer needs to be precisely controlled. Usually, the photoresist layer is thinned by spin coating. The specific principle is to use centrifugal force to throw ... En savoir plus
Prior to the reliability testing, surface-mount devices (SMDs) are required to go through a preconditioning process, which represents the effects of storage and the typical reflow operation in the following board assembly process. During the preconditioning process, test samples usually ... En savoir plus
The Czochralski (CZ) method is one of the most important methods for the preparation of monocrystalline silicon. The shape of the crystal, especially the diameter, is controlled by carefully adjusting the heating power, the pulling rate, and the rotation rate of the crystal. This model ... En savoir plus
Reflow soldering is an important process in IC packaging. In reflow soldering, the solder materials are melted to create joints between electrical components and the PCBs for structural and electrical connections. This model demonstrates the process of attaching chips to a PCB by reflow ... En savoir plus
This model studies a small orifice located in a duct. The transmission and reflection coefficients of the system are computed in the presence of a bias flow using the linearized Navier-Stokes equations. For certain frequencies the transmission coefficient shows amplification (T>1). This ... En savoir plus
This model is used on "Heat Transfer with Radiation in Participating Media and the Discrete Ordinates Method" to compare quadrature sets used in the method of discrete ordinates. To assess the performance of quadrature sets in complex geometries, results of incident irradiation and ... En savoir plus
This is a model of a simple thermoacoustic engine that includes a thermal stack to convert thermal energy to acoustic energy. The model is set up using two approaches: 1) Using a linear perturbation (acoustic) approaches solving the fluid motion with the Thermoviscous Acoustics, ... En savoir plus