La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
This model shows how to model the avalanche breakdown due to the impact ionization in a Silicon Carbide diode. The current-voltage (I-V) characteristics of the device are presented as well as the electric field distribution plot. Furthermore, the carrier generation term has been computed ... En savoir plus
This model simulates arc welding of a titanium plate made from an alpha-beta titanium alloy. During a weld pass, the material experiences a thermal transient, including both heating and cooling. Phase transformations are modeled, and the evolution of the phase composition over time is ... En savoir plus
This model illustrates the charge/discharge control of a Lithium-Ion battery in a Simulink® simulation. En savoir plus
This tutorial demonstrates how to model the band-to-band tunneling across a p–n junction. The tunneling effect is imitated by defining the User-Defined Recombination domain feature which makes the electrons disappear from the conduction band on the n-side and holes disappear from the ... En savoir plus
This tutorial example is kindly provided by Dr. James Ransley at Veryst Engineering, LLC. This model continues from the base model “A Micromachined Comb-Drive Tuning Fork Rate Gyroscope”, which is also provided by Dr. Ransley. The model demonstrates how to accurately compute the effects ... En savoir plus
A plane electromagnetic wave is incident on a metallic sphere partially embedded on a substrate. In this electromagnetic scattering problem, the far-field variables are computed for a few elevation angles of incidence. En savoir plus
This example studies viscoplastic creep in solder joints under thermal loading using the Anand viscoplasticity model, which is suitable for large, isotropic, viscoplastic deformations in combination with small elastic deformations. The geometry includes two electronic components (chips) ... En savoir plus
The ball grid array (BGA) technology is a surface-mount technology widely used in electronic packaging. Usually, there are two types of solder balls considered in the array, including the functional balls that are required for electric connections and the support balls that are used only ... En savoir plus
This example illustrates the principle of wet chemical etching for 2D geometry under laminar flow. The purpose of this tutorial is to examine how the copper substrate material is depleted and how the cavity shape evolves during the wet etching process. Wet chemical etching is ... En savoir plus
This model computes the temperature distribution in a battery pack that is in use at a specified power. The current is controlled in Simulink® to ensure constant power during usage. En savoir plus