La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
Modern integrated circuits are available as plastic encapsulated microcircuits (PEM). These devices are molded out of polymeric materials and epoxy resins in order to protect the internal semiconductors. Unfortunately, polymeric mold compounds absorb moisture when exposed to a humid ... En savoir plus
This model demonstrates how to set up a phase field damage multiphysics model to predict crack propagation in thermoelastic solids under large deformations. The crack-driving force depends on the principal stresses, which in turn depend on the temperature distribution in the solid ... En savoir plus
Reflow soldering is an important process in IC packaging. In reflow soldering, the solder materials are melted to create joints between electrical components and the PCBs for structural and electrical connections. This model demonstrates the process of attaching chips to a PCB by reflow ... En savoir plus
When a temperature gradient in a gas exists, suspended particles will tend to move from regions of high temperature to low. The force which produces this effect is called the thermophoretic force. Gas molecules colliding with a particle from the hot side have a higher velocity than the ... En savoir plus
Basin-type insulators are essential components in Gas-Insulated Metal-Enclosed Switchgear (GIS). During manufacturing, the epoxy resin curing process can generate residual stresses that may lead to crack formation. Over time, such cracks can trigger partial discharges, degrading the ... En savoir plus
In this example you will build and solve a 3D beam model using the 3D Beam interface. This model shows how a thermally induced deformation of a beam is modeled. Temperature differences are applied across the top and bottom surfaces as well as the left and right surfaces of the beam. ... En savoir plus
Small heating circuits find use in many applications. For example, in manufacturing processes, they heat up reactive fluids. The device in this tutorial example consists of an electrically resistive layer deposited on a glass plate. The layer results in Joule heating when a voltage is ... En savoir plus
This example treats the modeling of sub-surface flow where free convection in porous media is analyzed. The results are compared with published literature in the field. The model couples the momentum balance to an energy balance through an equation, dependent on temperature, being ... En savoir plus
This example demonstrates how to plot the interference pattern from the combination of two rays with slightly different optical path length. A simple Michelson interferometer is used to achieve a change of optical path length by slightly moving one of the mirrors. En savoir plus
This is a model of acoustic absorption by a porous acoustic open cell foam. In porous materials the sound propagates in a network of small interconnected pores. Because the dimensions of the pores are small, losses occur due to thermal conduction and viscous friction. Acoustic foams are ... En savoir plus