La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
This model illustrates the charge/discharge control of a Lithium-Ion battery in a Simulink® simulation. En savoir plus
This tutorial demonstrates how to model the band-to-band tunneling across a p–n junction. The tunneling effect is imitated by defining the User-Defined Recombination domain feature which makes the electrons disappear from the conduction band on the n-side and holes disappear from the ... En savoir plus
This model computes the input impedance/admittance to an acoustic system in the frequency domain. The system here represents a typical measurement setup used for testing hearing aids and includes domains with thermoviscous boundary layer losses. The input admittance, computed in the ... En savoir plus
FEM simulation can be used to obtain a SAW velocity and some related parameters (squared electromechanical coupling coefficient, reflectivity, etc.) for different typical configurations. Such parameters are input data for various analytical and semi-analytical methods of SAW device ... En savoir plus
This tutorial example is kindly provided by Dr. James Ransley at Veryst Engineering, LLC. This model continues from the base model “A Micromachined Comb-Drive Tuning Fork Rate Gyroscope”, which is also provided by Dr. Ransley. The model demonstrates how to accurately compute the effects ... En savoir plus
The ball grid array (BGA) technology is a surface-mount technology widely used in electronic packaging. Usually, there are two types of solder balls considered in the array, including the functional balls that are required for electric connections and the support balls that are used only ... En savoir plus
This example studies viscoplastic creep in solder joints under thermal loading using the Anand viscoplasticity model, which is suitable for large, isotropic, viscoplastic deformations in combination with small elastic deformations. The geometry includes two electronic components (chips) ... En savoir plus
The model of 1D Dielectric Barrier Discharge (DBD) has been recomputed with the three different kinds of electron energy distribution functions (EEDFs): The Maxwellian function The Druyvesteyn function The computed EEDF based on the Boltzmann Equation, Two-Term Approximation ... En savoir plus
This model shows how to model a simple Metal–Insulator–Metal (MIM) diode. The two metal electrodes are defined on each side using the Metal Contact feature. Two studies were performed: one without quantum tunneling across the potential barrier and the other including it, using the WKB ... En savoir plus
This tutorial demonstrates how to build the geometry for the 3D biased resonator from GDS file using the ECAD Import Module and the Design Module. The procedure emulates semiconductor and MEMS fabrication processes to build 3D geometry more efficiently and is more intuitive for those ... En savoir plus
