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Effect Of Heat And Mechanical Properties On Thermal Vias Of PCB Mounted With LED Driven Of QFN Package
Publié en 2015
The semiconductor and IC package manufacturer are continuously seeking for miniaturization devices to fix into a small space. An unfortunate miniaturization of devices will have an effect on heat dissipation density, which leads to low rate of heat dissipation to the ambient. As a result, the chip temperature increases which eventually degrade the entire system of the circuit. Therefore, in this paper the heat transfer and mechanical analysis of LED IC driver QFN package is presented by using COMSOL Multiphysics.
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- supian_poster.pdf - 3.3MB
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