Consultez les proceedings de la Conference COMSOL 2020
Modeling Transport of Antimicrobials Encapsulated in Yeast Microparticles for Biofilm Inactivation
A biofilm is a community of microbes embedded in a self-secreted polymer matrix. It may persist in different environments, and in the case of pathogens, these biofilms can be a significant risk factor for foodborne disease and healthcare-associated infections. Due to the unique structure ... En savoir plus
Mathematical and Computational Analysis on Sintering Densification of Binder Jet Printed Valvebody
Binder jet printing (BJP) is one of the additive manufacturing methods that are being widely implemented as an efficient alternative for casting and machining in the automotive industry. Sintering densification of the as-printed part (green part) adds uncertainty and possible undesirable ... En savoir plus
Optimizing Three-Dimensional Microelectrode Geometries for Neurostimulation
Neuromodulation, a closed-loop therapy that combines the recording and stimulation of neurons using implanted electrodes, is widely considered the future of care for many neurological diseases including epilepsy and Parkinson’s. Existing neuromodulation therapies, however, are limited by ... En savoir plus
COMSOL® Modeling of Self-Limiting Electrospray Deposition
Electrospray Deposition (ESD) is a process used in manufacturing that utilizes a charged capillary to disperse a flowing liquid into a spray that deposits onto a grounded target substrate. The build-up of charge on the substrate can begin to deflect further spray, allowing the material ... En savoir plus
System Reliability Analysis Using Monte Carlo Based Method and Neural Networks
This paper examines and develops a method for calculating the probability of structural failure by using Monte Carlo simulation and combining it with a neural network approach. In order to assess the validity of this method, a simple concrete beam model with a corrosion crack is built ... En savoir plus
3D Inspection of AM Components Using CT: From Defect Detection to Thermal Simulation in COMSOL Multiphysics®
Metal Additive Manufacturing (AM) can be used to create topologically complex designs that would otherwise be difficult or impossible to produce using traditional methods. However, non-destructive inspection and testing of these structures is made difficult by the presence of internal or ... En savoir plus
Numerical Modeling of Wire Directed Energy Deposition Additive Manufacturing (Wire-DED) Process
COMSOL Multiphysics® is being utilized to develop Thermal Model for Wire Directed Energy Deposition Additive Manufacturing (Wire-DED) process with an objective to analyse the heat transfer phenomenon during and after the process. Wire-DED process’s growing industrial acceptance at a very ... En savoir plus
Inverse-Design in Large Photonic Gratings Enabling Efficient Photonic-to-Free-Space Mode Coupling
Realization of an efficient coupling between photonic sub-micrometer size modes and hundred micrometer wide free-space beams remains a main engineering hurdle to a wider acceptance of miniaturized chip-scale atomic and bio systems. The major obstacle comes from a gigantic mode mismatch ... En savoir plus
Investigation of 1D Compressible Navier Stokes Using Equation-Based Modeling
A fundamentally important area of the COMSOL Multiphysics® code is that of equation-based modeling. This root capability is unique in commercially-available codes and offers unlimited application. One specific area that requires more detail, even in the CFD Module of COMSOL®, is that ... En savoir plus
Predictive Analytics and Uncertainty Quantification of a Microscale Porous Reactor Simulation
The use of computer simulations to analyze systems during the design process is a popular approach for validating and optimizing designs. But simulations are deterministic in nature and do not consider the uncertainty in design, manufacturing, and use of the product. Using predictive ... En savoir plus