Get Inspired by the Latest Collection of Simulation Projects
Papers and Presentations from the COMSOL Conference 2023
At the COMSOL Conference 2023, scientists and engineers from around the globe showcased their multiphysics simulation projects. See how researchers in your industry are currently using numerical modeling to optimize designs, streamline processes, and improve products by browsing the technical papers and presentations below. Use the Quick Search tool to find a specific presentation or filter by application area or conference location.
ISBN: 978-1-7364524-1-7
Towards Data Driven Design of Flow Blurring Atomizer
Liquid atomization relies on a variety of forces that disturb the surface of the liquid. In the case of flow-blurring (FB) atomization, turbulent structures are induced within the liquid channel to achieve this effect. It is known that the transition from the conventional flow-focusing ... En savoir plus
Two-Scale Modeling Of The WAAM Process: Link Between Thermo-Hydrodynamics And Mechanics
Simulation of arc-wire additive manufacturing is under development in many academic and industrial sectors and at different scales. The study at the melt pool scale is often interesting to study deposition shapes and defects but not very relevant to calculate the stresses and strains at ... En savoir plus
Uncertainty Quantification and Propagation in Multiphysics Modeling of the PVT Growth of SiC Crystal
The wide bandgap semiconductor silicon carbide (SiC) has drawn increasing attention in recent years as a promising material for high-power, high-frequency, and high-temperature operating devices. These outstanding properties of SiC make it a good candidate to replace silicon in many ... En savoir plus
Unleash Power Within: Finite Element Modeling of Temporal Interference Stimulation of Phrenic Nerves
Introduction: Mechanical ventilation in the ICU can result in complications, including ventilator-induced diaphragmatic dysfunction (VIDD), leading to extended hospital stays and increased costs. This abstract presents a novel approach using multiple esophageal electrodes for phrenic ... En savoir plus
Using COMSOL® in a Connected Virtual Factory -Thermal RSM for Rapid Adaptable Packaging Line
A tablet blister cavity is thermally modelled using the Shell interface in COMSOL® and a response surface created to connect to other simulations such as process flow/cost models to form a surrogate model. This virtually represents a pharmaceutical tablet packaging line, that is ... En savoir plus
Using of General Extrusion Operator in Heat Transfer Applications
In this paper, the COMSOL Certified Consultant BE CAE & Test shows as the general extrusion operators can be successfully used to simulate thermal transfers in an industrial rotating furnace. Heat transfer in translating and rotating furnaces is a topic of high interest in several ... En savoir plus
Utilizing COMSOL® in a Workflow to Asses Stroke Risks in a Large Set of Patient’s Carotid Arteries
In the medical field the risk assessment of strokes caused by pathological irregularities in the carotid artery bifurcation area plays a great role for the best patient’s treatment decision.The stroke risk evaluation by physicians traditionally incorporates evaluation of the stenosis ... En savoir plus
Visualization of a Noise Barrier for Educational Purposes Using a COMSOL App
The COMSOL® app library of the Technical University of Munich is a collection of applications for simulating acoustic phenomena. They are used in the teaching of acoustics to visually represent fundamental vibrational aspects and provide learners with a visual understanding. In the ... En savoir plus
Which Hardware to Choose for the Optimal Simulation with COMSOL®
Besides the accuracy of the results, the required computation time is an important factor for simulations in general. Thus, the question arises, that is also discussed in many blog posts, which computer properties influence the computation time. Here, we present findings from a ... En savoir plus
Wire Bonding: A Thorough Numerical Methodology
The semiconductor industry is always looking for early anticipation of manufacturing risk, pushing the development of Computer Aided Engineering (CAE) modeling of processes. Robust Chip-Package Interaction requires a deep understanding of thermo-mechanical stresses imposed during the ... En savoir plus