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Voyez comment la modélisation et la simulation sont utilisées par les industries La modélisation et la simulation multiphysiques pilotent l'innovation dans tous les grands secteurs d'activité et dans le monde universitaire — comme en témoignent les nombreuses utilisations présentées dans des articles et des posters techniques présentés par des ingénieurs, chercheurs et scientifiques à la Conférence COMSOL chaque année. Inspirez-vous des récents proceedings réunis ci-dessous, ou, pour trouver les présentations les plus intéressantes dans votre domaine d'intérêt, utilisez la recherche rapide.

Consultez les proceedings de la Conference COMSOL 2024

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Heat Transfer and Phase Change

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A Virtual Product Development Environment for Electronic Hydraulic Power Steering Pump via Multiphysics Modeling

F. Qi [1], J. Men [1], L. Yang [1], Z. Bing [1] , J. Yang [1], F. He [2], L. Pan [2], Z. Shao [2], G. Gao [2], X. Zhang [3], H. Wei [3], S. Duo [3], L. Song [3], X. Wang [3], Z. Wang [3], G. Wei [3], Y. Li [3], H. Yang [3], Z. Ma [3], B. Li [3], Y. Zhang [3], Y. Li [3], Y. Xie [3], D. Yu [3]
[1] FZB Technology, Inc., Plymouth, MI, USA
[2] Shenzhen South Dare Auto Parts, Ltd., Shenzhen, China
[3] Fuxin Dare Auto Parts, Ltd., Fuxin, China

Using advanced computational fluid dynamics software PumpLinx and the COMSOL Multiphysics® software, a virtual product development environment was established for the electro-hydraulic power steering pump system in a passenger vehicle. The model built with the COMSOL Multiphysics® ... En savoir plus

Thermal Analysis of Dry Type Power Transformer under Effect of Linear and Nonlinear Loads

R. G. Mafra [1],
[1] Universidade Federal de Itajubá, Itajubá, MG, Brazil

The thermal performance of the dry type power transformers is directly connected to the internal heat source caused by electrical losses. Thus, it is necessary to evaluate the temperatures reached by the transformer core to ensure optimum operation. This paper presents a detailed ... En savoir plus

Simulation of Electro-Thermal Transients in Superconducting Accelerator Magnets

L. Bortot [1], M. Maciejewski [2], M. Prioli [1], B. Auchmann [3],
[1] CERN, Geneva, Switzerland
[2] CERN, Geneva, Switzerland; Lodz University of Technology, Lodz, Poland
[3] CERN, Geneva, Switzerland; Paul Scherrer Institute, Zurich, Switzerland

The paper presents the application of COMSOL Multiphysics® software to the modelling of superconducting accelerator magnets. A 2D magneto-thermal model is developed, using an equivalent magnetization formulation to take into account the eddy-currents’ effects. Due to the model ... En savoir plus

Thermal Analysis on Module Level in an Automotive Battery Package

Z. Wu [1], H. Kemper [1],
[1] Energy Storage Systems, FH Aachen, Aachen, Germany

Vehicles with battery as energy storage fascinate more and more people. Meanwhile, more questions are surfaced – How to ensure a safe operation of the battery package? How long could the cycle life of a battery package reach? Can a battery package be operated in any environmental ... En savoir plus

Finite Element Modeling of Dispersion and Thermal Noise in Whispering-Gallery Mode Cavities

N. M. Kondratiev [1], M. L. Gorodetsky [1]
[1] Russian Quantum Center (RQC), Moscow, Russia

This work is dedicated to exact numerical modeling of modal dispersion and thermal noise in arbitrary cylindrical symmetric WGM structure. We develop a method and compare the results with experimental data from literature. We show that the real form of the resonator makes small influence ... En savoir plus

Design of a Heat Trap for Optimal Heat and Current Conduction on Soldering Pads

F. Figueroa [1], P. Aguirre [1],
[1] STW, Sensor Technik Wiedemann GmbH, Kaufbeuren, Germany

This poster presents an evaluation study of a couple of heat trap designs, analyzing the generation of Joule heating and heat dissipation characteristics. Through parametric simulations of the heat traps varying geometries, it is possible to see the generated temperature difference at a ... En savoir plus

Modeling Thermo-Fluid Dynamics of a Processing Unit of the Fast-track Trigger for ATLAS

N. Delmonte [1], P. Cova [1], A. Lanza [2], P. Giannetti [3], A. Annovi [3], S. Daniele [4], ,
[1] University of Parma and Istituto Nazionale di Fisica Nucleare - Sezione di Pavia, Pavia, Italy
[2] Istituto Nazionale di Fisica Nucleare - Sezione di Pavia, Pavia, Italy
[3] Istituto Nazionale di Fisica Nucleare - Sezione di Pisa, Pisa, Italy
[4] University of Parma - Department of Information Engineering, Parma, Italy

We describe the thermal modeling of a crate hosting boards with Associative Memories (AM) designed for the Fast Tracker Trigger (FTK) system of the ATLAS detector at the CERN Large Hadron Collider. FTK is a highly paralleled hardware system designed to provide global tracks reconstructed ... En savoir plus

Model of Microwave-Assisted Thermal Adhesion of Synthetic Leather to a Plastic Substrate

S. Soldatov [1], J. Meiser [2], B. Lepers [1], G. Link [1], J. Jelonnek [3],
[1] Karlsruhe Institute of Technology (KIT, IHM), Karlsruhe, Germany
[2] Carl Meiser GmbH & Co. KG, Albstadt, Germany
[3] Karlsruhe Institute of Technology (KIT, IHM, IHE), Karlsruhe, Germany

The lamination of substrates with thin coatings is commonly used in furniture, automotive and avionic industries. In the lamination process the hot melt adhesives are widely used and typically activated at temperatures from 80°C to 140°C by resistive heating. This requires a heat ... En savoir plus

Predicting Degradation of a Composite Material Due to an Injected Current

J. Rivenc [1],
[1] Airbus Group Innovations, Toulouse Cedex, France

The purpose of this study is to predict, with a multiphysics model, the degradation area of a composite material when a current is injected into the material. The main physical phenomenon is an exothermic reaction, with an irreversible nonlinear variation of the electrical conductivity. ... En savoir plus

Simulation of Electro-Thermal Behavior of an Overlap Solder Interconnection

A. Koushki [1],
[1] Rostock University, Rostock, Germany

Solder connections are one of the most essential parts of the PCBs. Despite many well-known scientific works that have been done about overlap solder interconnection properties, such as fracture, fatigue and reliability studies, little attention have been given to the investigation of ... En savoir plus

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