Articles techniques et présentations

Heat conduction problems can be divided into direct and inverse problems. In direct problems, the thermal boundary condition (heat flux or temperature) is given and its effect is calculated, while for inverse problems the boundary condition is determined based on its effect. For some ... En savoir plus

Two-component adhesives are commonly used for sealing and joining in transport applications for mechanically highly stressed connections. At the Chemnitz University of Technology an innovative system technology for the user-friendly, wireless and energy-efficient processing of two ... En savoir plus

The measurement and regulation of particulate matter to improve outside air quality advanced a lot over the last decades. This also made it necessary to develop primary standards for calibrating these measurement systems and in future the composition of relevant aerosols will be taken ... En savoir plus

Induction furnace plays a very important role in the melting of high metal & metallic alloys. This furnace has an ability to quickly and efficiently heating of the material without being in physical contact. Such kind of heating mechanisms offers appropriate technology solutions to many ... En savoir plus

The Purpose of this paper is to develop a thermal model using COMSOL Multiphysics® software that aims to get an idea of the heat flow around the ASIC, as well as to address the thermal issues for integrated circuits at the tongue board. However, we need sources of heat simulations to map ... En savoir plus

In the field of electric machines, a trend towards both higher efficiency and higher power density is observed. This has led to a growing importance of Permanent Magnet Synchronous Machines. However, the magnets used in these machines risk demagnetization at high temperatures. Especially ... En savoir plus

The need for high storage capacitors led to the development of polymer based capacitors. Polymers have high processability, mechanical flexibility, electrical breakdown strength and compatibility with printed circuit board (PCB) technologies; but usually have very low permittivity (K). ... En savoir plus

Lamb waves are elastic waves propagating in free solid plates. In the case of plates loaded with a fluid, the equations describing these waves have to be modified to include the effects of the fluid. In our work we have tackled this problem using COMSOL Multiphysics®. We have used the ... En savoir plus

In this work we investigate a wet-chemical silicon etching process. COMSOL Multiphysics® is used to extract local pressure values to correlate them to experimental results. The test setup consists of a box with a fixed wafer and a nozzle that injects an etchant jet onto the wafer ... En savoir plus

The progression toward smaller and faster photonic circuits has led to the development of nanophotonic platforms capable of compacting many devices onto an integrated chip. These devices, as well as the input and output grating couplers, are sometimes polarization dependent, which allows ... En savoir plus