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Ici vous trouverez les présentations issues des Conférences COMSOL à travers le monde. Réalisées par des utilisateurs de COMSOL Multiphysics, ces présentations explorent tous les domaines actuels d'innovation. Les applications couvrent pratiquement tous les secteurs industriels et impliquent des phénomènes électriques, mécaniques, fluidiques et chimiques. Utilisez la recherche rapide pour trouver les présentations les plus intéressantes dans votre domaine d'intérêt.

Consultez les proceedings de la Conference COMSOL 2024

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Nanoporous Silicon Structures for Toxin Detection

H. Ghosh[1], C. R. Chaudhuri[1]
[1]Department of Electronics and Telecommunication, BESUS, Howrah, West Bengal, India

In this project, we are aiming towards the development of an impedimetric biosensor based on nanoporous silicon structures for the detection of small molecular size and low weight food toxins (like Aflatoxin). Existing sensors for such toxin detection fail to achieve high sensitivity ... En savoir plus

Expanding Your Materials Horizons

R. Pryor[1]
[1]Pryor Knowledge Systems, Inc. (COMSOL Certified Consultant), Bloomfield Hills, Michigan, USA

Materials and their related properties are intrinsically fundamental to the creation, development and solution of viable exploratory models when using numerical analysis software. In many cases, simply determining the location, availability and relative accuracy of the necessary material ... En savoir plus

Time-Harmonic Modeling of Squirrel-Cage Induction Motors: A Circuit-Field Coupled Approach

R. Escarela-Perez[1], E. Melgoza[2], and E. Campero-Littlewood[1]

[1]Universidad Autonoma Metropolitana - Azcapotzalco, Departamento de Energia, México, D.F., Mexico
[2]Instituto Tecnologico de Morelia, Morelia, Mich., C.P., Mexico

Finite element modeling of three-phase induction machines requires the solution of coupled circuit and field equations. This work aims to solve this problem using a strong coupling approach. This work includes circuit field coupling and proper air-gap meshing, using the AC/DC Module of ... En savoir plus

Microstimulation in The Brain: Does Microdialysis Inuence the Activated Volume of Tissue?

D. Krapohl[1][3], S. Loeffler[2], A. Moser[2], and U.G.Hofmann[1]

[1]Institute for Signalprocessing, University of Luebeck, Lübeck, Germany
[2]Institute for Neurology, University of Luebeck, Lübeck, Germany
[3]Department of Information Technology and Media, Mid Sweden University, Sundsvall, Sweden

Deep Brain Stimulation (DBS) has been established as an effective treatment for Parkinson's disease and other movement disorders. The stimulation is currently administered using tetrode-macroelectrodes that target the Subthalamic Nucleus (STN). This often leads to side effects which bias ... En savoir plus

Finite Element Analysis of Curved Cone Corrugated Ground Plane Conical Antenna

R. Sharma, and A. Marwaha
SLIET, Longowal, Sangrur
Punjab, India

Curved cone corrugated ground plane conical antenna has been designed and analyzed using Finite Element Method. In this paper, we introduce a novel Curved cone corrugated ground plane conical antenna for ultra-wideband (UWB) applications. The antenna is composed of curved cone with ... En savoir plus

Wireless Interaction of Neighboring Two Arm Archimedes Spiral Coils in the RF Electromagnet Range

A. Kalinowski[1]
[1]Naval Undersea Warfare Center/ Division Newport, Newport, RI, USA

The paper addresses a class of problems for modeling and consequently simulating the electromagnetic field radiation pattern from two arms Archimedes spiral coils. The frequency spatial wavelengths relative to the coil dimensions are in a range where the electromagnetic Maxwell’s ... En savoir plus

Influence of the Excitation Frequency Increase up to 140 MHz on the VHF-PECVD Technology

S. Leszczynski[1], B. Leszczynska[1], M. Albert[1], J.W. Bartha[1], U. Stephan[2], J. Kuske[2]
[1]Dresden University of Technology, Semiconductor and Microsystems Technology Laboratory, Dresden, Germany
[2]Forschungs- und Applikationslabor Plasmatechnik GmbH, Dresden, Germany

The plasma enhanced chemical vapor deposition process with a linear plasma source and the frequency range up to 140 MHz developed by Dresden University of Technology and FAP GmbH Dresden enables a fabrication of thin film silicon layers at very high deposition rates. However, an increase ... En savoir plus

Calculation of Cable Parameters for Different Cable Shapes

H. Lorenzen[1], J. Timmerberg[1], and S. Mylvaganam[2]
[1]Department of Electrical Engineering, UAS OOW, Wilhelmshaven, Germany
[2]Department Technology/Engineering, Telemark University College, Porsgrunn, Norway

Efforts involving simulation of transmission line networks necessitate the accurate values of the parameters of the lines. In this paper, as an attempt in estimating such parameters, the parameters of high voltage asymmetric power lines are calculated. In the process of estimation, the ... En savoir plus

Accuracy of Fully Coupled Loudspeaker Simulation Using COMSOL

M. Hedges[1][2] and Y.W. Lam[1]
[1]Acoustics Research Centre, School of Computing, Science & Engineering, University of Salford, Salford, United Kingdom
[2]Monitor Audio Ltd., Rayleigh, Essex, United Kingdom

Loudspeaker simulation is used to inform the designer as to the performance of a design. In recent years the Finite Element Method (FEM) has been used to model the mechanical and acoustical attributes of a loudspeaker with varying success. This paper shows how a model that incorporates ... En savoir plus

Linking The Dimensions

A. Helfrich-Schkarbanenko[1], M. Mitschele[2], S. Ritterbusch[1], and V. Heuveline[1]
[1]Engineering Mathematics and Computing Lab (EMCL), Karlsruhe Institute of Technology (KIT), Karlsruhe, Germany
[2]Institute for Analysis, Karlsruhe Institute of Technology (KIT), Karlsruhe, Germany

We consider a 3D boundary value problem arising in electrostatics. The potential is stimulated by current sources placed on a cross-section S of the domain. In many applications it is sufficient to know the potential in S. So, one is interested in an appropriate 2D model taking into ... En savoir plus

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