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Voyez comment la modélisation et la simulation sont utilisées par les industries La modélisation et la simulation multiphysiques pilotent l'innovation dans tous les grands secteurs d'activité et dans le monde universitaire — comme en témoignent les nombreuses utilisations présentées dans des articles et des posters techniques présentés par des ingénieurs, chercheurs et scientifiques à la Conférence COMSOL chaque année. Inspirez-vous des récents proceedings réunis ci-dessous, ou, pour trouver les présentations les plus intéressantes dans votre domaine d'intérêt, utilisez la recherche rapide.

Consultez les proceedings de la Conference COMSOL 2024

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Calculation of Capacitances of Symmetrical Triple Coupled CPW Transmission Lines and Multilayer CPW Broadside Coupled Lines Balun

S. Musa[1], M. N. O. Sadiku[1]
[1]Prairie View A&M University, Prairie View, TX, USA

The accurate estimate of values of electromagnetic parameters are essential to determine the final circuit speeds and functionality for designing of high-performance integrated circuits and integrated circuits packaging. In this paper, the quasi-TEM analyses of symmetrical triple coupled ... En savoir plus

Modeling with COMSOL the Interaction Between Subducting Plates and Mantle Flow

J. Rodríguez-González[1], A.M. Negredo[1], P. Petricca[2], and E. Carminati[2][3]

[1]Departamento de Geofísica y Meteorología, Facultad de CC. Físicas, Universidad Complutense de Madrid, Madrid, Spain
[2]Dipartimento di Scienze della Terra, Università di Roma La Sapienza, Roma, Italy
[3]Istituto Geologia Ambientale e Geoingegneria – CNR, Roma, Italy

Subduction processes have great importance as are related to volcanism and earthquake occurrence. Old and cold plates should subduct steeper than younger ones, but the subduction angle is highly variable and does not always correlate with the age of the plates. Some researchers propose a ... En savoir plus

Influence of Vickers Indenter Tip Geometry on the Macro-indentation Properties of TiAl Alloys

G. Maizza, and R. Cagliero
Politecnico di Torino
Dipartimento di Scienza dei Materiali ed Ingegneria Chimica
Torino, Italy

In this work the influence of the geometry of the Vickers indenter tip on relevant indentation properties is investigated during instrumented indentation operated in the macro range (i.e. with forces ranging from 2 to 200 N) and carried out in the case of a homogenized (i.e. heat ... En savoir plus

Modeling of Multiconductor Microstrip Systems on Microwave Integrated Circuits

S. Musa[1], M. N. O. Sadiku[1]
[1]Prairie View A&M University, Prairie View, TX, USA

The microstrip line is widely used as the planar transmission line in microwave integrated circuits and high speed interconnecting buses. In this paper, we use COMSOL Multiphysics® to study multiconductor microstrip systems on microwave integrated circuits. We specifically illustrate ... En savoir plus

Simulating HFIR Core Thermal Hydraulics Using 3D-2D Model Coupling

A. Travis[1], K. Ekici[1], J. Freels[2]
[1]The University of Tennessee, Knoxville, TN, USA
[2]Oak Ridge National Laboratory, Oak Ridge, TN, USA

A model utilizing interdimensional variable coupling is presented for simulating the thermal hydraulic interactions of the High Flux Isotope Reactor (HFIR) core at Oak Ridge National Laboratory (ORNL). The model’s domain consists of a three-dimensional fuel plate and a two-dimensional ... En savoir plus

Numerical Analysis of the Response of Thick Wires to Extreme Dynamic Electro-Mechanical Loads

R. Cunrath[1], M. Wickert[2]
[1]Fraunhofer EMI, Efringen-Kirchen, Germany
[2]Fraunhofer EMI, Freiburg im Breisgau, Germany

Research at Fraunhofer EMI addresses the response of materials in extreme dynamic loads. Besides mechanical or thermal loads, intense electric pulse currents also represent an extreme dynamic load. Experimentally, metallic samples, mainly thick wires, were electro-mechanically loaded ... En savoir plus

PA Loudspeaker System Design Using Multiphysics Simulation

R. Balistreri [1],
[1] QSC Audio Products, LLC., Costa Mesa, CA, USA

This paper utilizes lumped circuits equivalent and pressure acoustics to simulate the behavior of a PA loudspeaker in order to improve its design. En savoir plus

COMSOL Multiphysics® Simulations of Graphene Chemical Vapor Deposition (CVD) Growth

K. M. Al-Shurman[1], H. Naseem[1]
[1]The Institute for Nanoscience & Engineering, University of Arkansas, Fayetteville, AR, USA

Chemical vapor deposition (CVD) is a promising effective method for synthesis of graphene films. CVD graphene film is obtained from hydrocarbon species such as CH4 through complex catalytic chemical reactions on the surface of the catalyst. Therefore, studying the catalytic reaction ... En savoir plus

Mathematical Model for Prediction of Transmission Loss for Clay Brick Walls

J. Ratnieks[1], A. Jakovics[1], J. Klavins[1]
[1]Laboratory for Modeling Technological and Environmental Processes, University of Latvia, Riga, Latvia

A 2D numerical model for determination of sound reduction index is set up in this work. Results are in good agreement in middle and high frequency range when using solid structure approximation. Results are compared with experiment. En savoir plus

A Systematic Method for Producing Simulated Scattered Field Data from Known Structures

R. S. Ritter [1], M. A. Fiddy [2],
[1] Olivet Nazarene University, Bourbonnais, IL, USA
[2] University of North Carolina - Charlotte, Charlotte, NC, USA

One of the greatest challenges in developing algorithms for imaging from scattered fields is the lack of suitable scattered field data from known targets. It has proved quite difficult to acquire this data from measurements in the laboratory due the fact it can be costly, time ... En savoir plus

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