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Voyez comment la modélisation et la simulation sont utilisées par les industries La modélisation et la simulation multiphysiques pilotent l'innovation dans tous les grands secteurs d'activité et dans le monde universitaire — comme en témoignent les nombreuses utilisations présentées dans des articles et des posters techniques présentés par des ingénieurs, chercheurs et scientifiques à la Conférence COMSOL chaque année. Inspirez-vous des récents proceedings réunis ci-dessous, ou, pour trouver les présentations les plus intéressantes dans votre domaine d'intérêt, utilisez la recherche rapide.

Consultez les proceedings de la Conference COMSOL 2024

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Three-Dimensional Modeling of Electrical Scanning Probe Microscopy Problems

G. Gomila [1], L. Fumagalli [2], R. Fabregas [3],
[1] Institut de Bioenginyeria de Catalunya (IBEC), Departament d’Electrònica, Universitat de Barcelona, Barcelona, Spain
[2] School of Physics and Astronomy, University of Manchester, Manchester, United Kingdom
[3] Institut de Bioenginyeria de Catalunya (IBEC), Universitat de Barcelona, Barcelona, Spain

Electrical scanning probe microscopy (SPM) techniques, such as electrostatic force microscopy, nanoscale impedance microscopy or scanning near field microwave microscopy, are a relatively new branch of microscopy techniques that can generate images of the nanoscale electrical properties ... En savoir plus

Numerical Modeling of Resistive Switching in a RRAM Device

D. Niraula [1], V. Karpov [1],
[1] University of Toledo, Toledo, OH, USA

A new nonvolatile memory device based on its resistance state has emerged known as resistive random access memory (RRAM). It operates by switching between the high resistance and low resistance states which can be interpreted as logical 0 and 1 variables. Understanding the resistive ... En savoir plus

Capacitance Computation of Multilayered and Multiconductor Interconnects Using Finite Element Method

S. Musa, and M. Sadiku
College of Engineering, Prairie View A&M University, Prairie View, TX, USA

The development and analysis of interconnects in inhomogeneous structures such as very large scale integration chips, printed circuit boards, and multichip modules are essential for next-generation electronic products. In this paper, we illustrate fast and sufficiently accurate ... En savoir plus

Local Electroporation of Single Adherent Cells by Micro-Structured Needle Electrodes

K. K. Sriperumbudur[1], P. J. Koester[1], M. Stubbe[1], C. Tautorat[1], J. Held[2], W. Baumann[1], and J. Gimsa[1]
[1] University of Rostock, Chair of Biophysics, Gertrudenstr. 11a, 18057 Rostock, Germany
[2] Microsystem Material Laboratory, Department of Microsystems Engineering (IMTEK), University of Freiburg, Germany

In spite of its low throughput, Patch-Clamp is the established method for intracellular measurements of the transmembrane potential. To address this problem, we have developed new biosensor-chips with micro-structured needle electrodes (MNEs). MNE-penetration of single cells growing on ... En savoir plus

Modeling and Analysis of a Feedback-Controlled Active Magnetic Levitation System using COMSOL Multyphysics Finite Element Software

M. Nabi[1], and K. V. Ajeeth[1]
Department of Electrical Engineering, Indian Institute of Technology Delhi, India

Magnetic levitation systems have been studied in the context of high-speed transportation as maglev trains, high speed machinery as magnetic bearings, and other similar engineering applications. In this paper, a three dimensional arbitrary shaped object is modeled and analyzed through ... En savoir plus

Analysis of an Electromagnet for Diverse Safety Rod Drive Mechanism

N. Subbulu[1], P. Sharma[1], V. Sharma[1], S.K. Das[1], R. Veerasamy[1], B. Krishnakumar[1], P. Kalyanasundaram[1], and G. Vaidyanathan[1]
[1] Fast Reactor Technology Group, Indira Gandhi Centre for Atomic Research, Kalpakkam, Tamil Nadu, India

Prototype Fast Breeder Reactor (PFBR) has two independent, diverse, fast acting & fail safe shut down systems to achieve the required level of safety & reliability (1). The shut down systems comprises of nine numbers of Control & Safety Rod Drive Mechanisms (CSRDM) & ... En savoir plus

Novel Automated Software System for Arcing Simulation in Spacecraft On-Board Electronics

V. Kozhevnikov [1], V. Karaban [2], D. Kosov [2], A. Kozyrev [1], A. Batrakov [1], N. Semeniuk [1], L. Zjulkova [1]
[1] Institute of High Current Electronics, Tomsk, Russia
[2] Tomsk State University of Control Systems and Radioelectronics, Tomsk, Russia

In our project, we propose an innovative software solution to the problem of electrical arcing risk prediction in high-voltage on-board electronic equipment intended for long-term self-contained use, e.g. in spacecraft conditions. It completely based on so-called “decomposition” approach ... En savoir plus

Secondary Electron Trajectories in Scanning Tunneling Microscopy

H. Cabrera [1], D. A. Zanin [1], L. G. De Pietro [1], A. Vindigni [1], U. Ramsperger [1], D. Pescia [1],
[1] Laboratory for Solid State Physics, Microstructure Research, ETH Zurich, Zurich, Switzerland

The recently developed technique Scanning Tunneling Microscopy in the Field Emission regime (STM FE) is based on the Russell Young's topografiner technology. The set-up is a no contacting device consisting of a sharp tip approached vertically to a conducting surface at variable distances ... En savoir plus

Calculation of the Magnetic Field Intensity in a Rectangular Conductor Carrying Current in Electromagnetism Introductory Courses

J.C. Olivares-Galvan[1], I. Hernandez[2] , P.S. Georgilakis[3], and L.E. Campero[1]

[1]Universidad Autónoma Metropolitana, Azcapotzalco, Mexico, D.F.
[2]Centro de Investigacion y de Estudios Avanzados del IPN, Unidad Guadalajara, Guadalajara, Jalisco, Mexico
[3]School of Electrical and Computer Engineering, National Technical University of Athens, Athens, Greece

This paper describes a type of didactic material used when teaching electromagnetism. The purpose is to guide the students to verify the results of a Finite Element (FE) simulation using those obtained analytically. This procedure has shown to be of great help during their learning of ... En savoir plus

Finite Element Analysis of Multiconductor Interconnects in Multilayered Dielectric Media

S. Musa and M. Sadiku
College of Engineering, Prairie View A&M University, Prairie View, TX, USA

Due to the complexity of electromagnetic modeling, researchers and scientists always look for development of accurate and fast methods to extract the parameters of electronic interconnects and package structures. In this paper, we illustrate modeling of multiconductor interconnects in ... En savoir plus

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