Articles techniques et présentations

The transfer molding process is a widely used method for encapsulating microelectronics and power semiconductor devices. In power electronics, it is gaining increasing importance, particularly in the automotive sector [1]. In transfer molding, an epoxy mold compound (EMC) is injected ... En savoir plus

This work deals with the computer simulation of the blood flow, the arterial wall deformation and their 3D bidirectional interaction, including initial stresses and root displacements. The flow is laminar and steady with flexible walls modeled with a hyperelastic Demiray material model. ... En savoir plus

The WaveEL buoy developed by the company Waves4power is characterized as a point absorber and has a 36 meters long vertical cylinder where a water-piston is oscillating due to induced motion from the waves. Estimating the wave loads on the piston is a challenge due to the presence of ... En savoir plus

This paper reports the design of a piezoelectric energy harvesting micro generator for an energy autonomous tire pressure monitoring wireless sensor node. For our design we use a piezoelectric MEMS generator approach without additional mass. The intrinsic mass of the cantilever is in the ... En savoir plus

Wafer bonding technology has become a crucial process in 3D IC integration, particularly as a key method for monolithic integration where Through-Silicon Via (TSV) technology is not used [1]. However, due to the intricate mechanical stress and interconnect reliability issues associated ... En savoir plus

Fluid Structure Interaction (FSI) plays an important role in the seismic analysis and the design of Hydraulic structures. In this study, the acoustic finite element model is analyzed with impounded water considering appropriate boundary conditions between the water & the upstream ... En savoir plus

The High Flux Isotope Reactor at the Oak Ridge National Lab is in the research stage of converting its fuel from high-enriched uranium to low-enriched uranium. One of the areas being explored is the fluid-structure interaction phenomenon due to the interaction of thin fuel plates (50 ... En savoir plus

Deformation of food packaging materials due to internal pressure buildup during sterilization is a critical concern for packaging integrity and product safety, particularly in non-rigid containers like polypropylene (PP) trays for ready-to-eat meals. (Dutta et al., 2024b). Internal ... En savoir plus

We present a problem-adapted finite element model, which enables the design of a novel type of a highly miniaturized, electrostatic MEMS membrane pump, as well as the investigation and the optimization of its operation. The electro-mechanical actuation scheme constitutes a strongly ... En savoir plus

For the purpose of investigation the inertial behaviour of the crystalline lens, the COMSOL Multiphysics® software was used to create a 2D multi-physics model of the porcine eye globe, by using the Fluid-Structure Interaction (FSI). The geometry of the porcine eye model was adapted from ... En savoir plus