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Voyez comment la modélisation et la simulation sont utilisées par les industries La modélisation et la simulation multiphysiques pilotent l'innovation dans tous les grands secteurs d'activité et dans le monde universitaire — comme en témoignent les nombreuses utilisations présentées dans des articles et des posters techniques présentés par des ingénieurs, chercheurs et scientifiques à la Conférence COMSOL chaque année. Inspirez-vous des récents proceedings réunis ci-dessous, ou, pour trouver les présentations les plus intéressantes dans votre domaine d'intérêt, utilisez la recherche rapide.

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P2D-三维传热耦合模型

杨昊松¹, 谈鹏¹
¹中国科学技术大学合肥市安徽省中国

本工作的主要内容是探究软包电池在充放电循环中由电池自身产热导致的温度分布以及温度对电化学反应速率的影响。模型中的电池传热模型由八个尺寸为1cm×1cm×180μm的电池微元组成，每个电池微元被视为一个均匀热源，使用COMSOL Multiphysics中的固体传热模块。电化学模型使用COMSOL Multiphysics中的电池模块，通过P2D模型计算电池的充放电过程以及反应热。每一个P2D模型对应传热模型中的一个电池微元，将电池的反应热视为电池微元的单位体积产热量。在三维传热模型的每一个电池微元中植入一个域探针，用来测量每个电池元在充放电过程中每一个时刻的平均温度 ... En savoir plus

PVT法生长单晶碳化硅过程中气相输运的数值模拟

许彬杰¹
¹浙江大学杭州国际科创中心

本研究对PVT法生长碳化硅晶体的气相输运过程进行了模拟，该模型包含了坩埚的内部和外部，而坩埚的接缝连接处被模拟为多孔石墨，可以允许内外气体进行交换。坩埚外部的流场情况为，氮气和氩气从PVT炉的底部通道流入，混合气体从PVT炉顶部流出。坩埚内部的流场情况为，碳化硅粉末升华产生SiC2，Si2C和Si蒸气并向上升华，在籽晶处沉积。同时，坩埚内部和外部的气体物质通过多孔接缝发生交换，氮气和氩气可通过多孔接缝扩散至内部，SiC2，Si2C和Si蒸气也可通过多孔接缝到达坩埚外部。碳化硅反应气体物质的升华和沉积用 Hertz-Knudsen来描述，对流和扩散由Navier ... En savoir plus

Reciprocating Flow Applied For Liquid-cooling-based Battery Thermal Management System

Wei ZENG¹
¹university of science and technology of china

Liquid cooling is the most popular battery thermal management system (BTMS) at present, while suffers from high energy consumption and high temperature difference between upstream and downstream. Herein, we first use a reciprocating liquid flow-based BTMS (RLF-BTMS) for cylindrical ... En savoir plus

Simulation of heat transfer in fibrous insulation materials

邹冠宇¹, William W. Sampson¹, Ian A. Kinloch²
¹Department of Materials, University of Manchester, Manchester, UK
²Henry Royce Institute, Manchester, UK

As the demand for lightweight fibrous insulation materials in aerospace [1] and automotive [2] applications increases due to their benefits in reducing carbon footprints and costs [3], accurate prediction of thermal properties becomes crucial, particularly before production. The thermal ... En savoir plus

Simulation of Stress-Optic Microresonator Modulator

Jiazhao He¹, Mingjian You¹, Zhenyu Liu¹, Zhengqi Li¹, Weiren Cheng¹, Ning Ding¹, Xingyu Tang¹, Jiaxin Hou¹, Qiancheng zhao¹
¹MOE Engineering Research Center of Integrated Circuits for Next Generation Communications, Southern University of Science and Technology, Shenzhen, Guangdong 518000, China

Photonic integrated circuits (PIC) play important roles in contemporary optical communication systems. Incorporating functional materials into PICs equips passive photonic devices with active modulation capabilities, unleashing great potentials in optical signal processing, quantum ... En savoir plus

Study of Direct Wafer Bonding Process Based on Coupled Structural Deformation and Fluid Dynamics

Sichen Liang¹, Zhiheng Huang¹, Min Xiao¹, Yuezhong Meng¹, Hui Yan², Yang Liu³
¹The Key Laboratory of Low-carbon Chemistry & Energy Conservation of Guangdong Province, and School of Materials Science and Engineering, Sun Yat-sen University, Guangzhou, Guang dong, China
²School of Computer Science and Engineering, Sun Yat-sen University, Guangzhou, Guang dong, China
³School of Electronics and Information Technology, Sun Yat-sen University, Guangzhou, Guang dong, China

Wafer bonding technology has become a crucial process in 3D IC integration, particularly as a key method for monolithic integration where Through-Silicon Via (TSV) technology is not used [1]. However, due to the intricate mechanical stress and interconnect reliability issues associated ... En savoir plus

TES探测器结构的电热耦合仿真

周俊杰¹, 张翼飞¹, 刘舟慧¹, 路雪峰¹
¹中国科学院高能物理研究所（IHEP）

超导转变边沿探测器（Transition edge sensor，TES）利用超导薄膜电阻对温度的高灵敏响应关系来精确测量光子能量。在TES探测器设计开发中，当前主要采用小信号原理，通过线性近似方式来建立探测器输出脉冲与各参数之间的关系，该方法无法分析探测器尺寸效应、信号饱和等情况，且无法处理更加复杂的结构，这限制了TES探测器技术的发展。在本研究中利用COMSOL Mutiphysics®软件进行TES吸收体与超导薄膜传热分布，与电信号反馈的仿真。首先，利用COMSOL固体传热模块进行对TES器件进行传热物理场的建模。然后利用AC ... En savoir plus

The simulation and experiment of Quantized Klein Tunneling in a Dielectric Resonator Chain

张瑞杰¹, 彭晓珍¹
¹兰州大学

Klein tunneling is one of the most striking consequences of Dirac equation. Despite experimental investigations of the phenomenon in analog systems in the transport or quasi-bound state scenario, a direct observation of quantized Klein tunneling is still lacking. Now this is achieved in ... En savoir plus

Thermal management system of prismatic batteries coupled with heat pipe and composite fin

Junjie Wang¹, Yin Yu¹, Laifeng Song¹, Yongbing Yue¹, Wei Zeng¹, Wenxin Mei¹, Qingsong Wang¹
¹State Key Laboratory of Fire Science, University of Science and Technology of China, Hefei, China

This research proposed a novel battery thermal management system that utilized the heat pipe coupling composite fin (HPCF) which consisted of aluminum fin, phase change material and liquid cooling tube. By using battery module, heat transfer module and CFD module of COMSOL, the ... En savoir plus

一种±200 kV高压直流充气插拔式电缆终端

罗艺¹
¹全球能源互联网欧洲研究院、柏林、柏林、德国

高压直流电缆终端和接头是直流电缆系统中的关键部件。我们团队设计开发了一种±200 kV高压直流充气插拔式电缆终端。该类型终端具有重量轻、安装时间短及爆炸风险低等优势。在设计过程中，我们依靠COMSOL Multiphysics，分别进行了电热耦合和机械应力仿真建模。其中电热耦合模型用于电场强度计算，而机械应力模型用于界面压强计算。利用该方法设计的高压直流电缆终端已成功通过型式试验，证明了该设计方法的可行性。后续的裕度实验进一步表明该系统具有充足的安全裕度，其在尺寸缩小和更高电压等级应用方面具有潜力。 En savoir plus

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