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Ici vous trouverez les présentations issues des Conférences COMSOL à travers le monde. Réalisées par des utilisateurs de COMSOL Multiphysics, ces présentations explorent tous les domaines actuels d'innovation. Les applications couvrent pratiquement tous les secteurs industriels et impliquent des phénomènes électriques, mécaniques, fluidiques et chimiques. Utilisez la recherche rapide pour trouver les présentations les plus intéressantes dans votre domaine d'intérêt.

Consultez les proceedings de la Conference COMSOL 2024

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Simulation of Quench Behaviour of the 11 T Superconducting Dipole for HL-LHC

M. Mentink [1], B. Auchmann [1], L. Bortot [1], M. Maciejewski [1], Marco Prioli [1], E. Ravaioli [1], E. Stubberud [1], A. Verweij [1],
[1] CERN, Switzerland

As part of the High Luminosity Large Hadron Collider a number of magnets is to be installed for the purpose of enhancing the performance of the Large Hadron Collider. The 11 T superconducting dipole is a magnet type that utilizes the Nb3Sn superconductor. A number of these magnets will ... En savoir plus

Designing Polymer Thick Film Intracranial Electrodes for use in Intra-Operative MRI Setting.

G. Bonmassar[1], and A. Golby[2]
[1]AA. Martinos Center, Massachusetts General Hospital, Charlestown, Massachusetts, USA
[2]Department of Neurosurgery, Brigham and Women’s Hospital, Boston, Massachusetts, USA

A new type of MRI compatible intracranial electrode based on Polymer Thick Film (PTF) is presented and studied using COMSOL Multiphysics. The geometry considered was a two-dimensional cross section cut of 5 mm thick electrodes with 5 cm leads on top of a 2×10 cm slab representing ... En savoir plus

Time Domain Reflectometry of a Water Tree inside an Underground Cable

K. Burkes [1],
[1] Savannah River National Laboratory, Jackson, SC, USA

This poster presents the electric field flowing through an insulated cable due to a high frequency voltage pulse in the presence of water trees. En savoir plus

Modeling Microwave Heating During Batch Processing of a Liquid Sample in a Single Mode Cavity

S. Curet [1], F. Bellicanta Begnini [1], O. Rouaud [1], L. Boillereaux [1]
[1] L’UNAM Université, ONIRIS, CNRS, GEPEA, Nantes, France

The use of microwaves for heating purposes of dielectric materials is encountered in many industrial applications (food processing, chemistry, material engineering and medical applications). In most of these thermal applications, the prediction of the temperature evolution within the ... En savoir plus

Rapid Prototyping of Biosensing Surface Plasmon Resonance Devices using COMSOL & Matlab software

J.J. Dubowski[1], and D.Carrier[1]
[1]Department of Electrical and Computer Engineering, Université de Sherbrooke, Quebec, Canada

We present a Finite Element Method simulation procedure that allows rapid development of prototype devices comprising novel self-referenced interference SPR (surface plasmon resonance) biosensing microstructures. The procedure takes advantage of COMSOL Multiphysics and MATLAB software ... En savoir plus

Experimental Observation and Numerical Prediction of Induction Heating in a Graphite Test Article

T.A. Jankowski[1], D.P. Johnson[1], J.D. Jurney[1], J.E. Freer[1], L.M. Dougherty[1], and S.A. Stout[1]

[1]Los Alamos National Laboratory, Los Alamos, New Mexico, USA

The induction heating coils used in the plutonium casting furnaces at the Los Alamos National Laboratory are studied here. A cylindrical graphite test article has been built, instrumented with thermocouples, and heated in the induction coil that is normally used to preheat the molds ... En savoir plus

Modeling of High-Speed PCB-Interconnects, Vias and Connectors for the Estimation of SI-Losses

A. K. Palit [1],
[1] ZF-Lemförder Electronic GmbH (ZF-Friedrichshafen AG. Group), Germany

Estimation of both single-ended (SE) and differential-pair (DP) impedances of high-speed PCB-traces/interconnects, vias and connectors is very important for the high-speed PCB (layout) design. This is because, the mismatch in line-impedances/improper line-termination results in a ... En savoir plus

Bioheat Dissipation of a Implantable Brain-Machine Interface

J. M. Herrera Morales [1],
[1] Wyss Center for Bio and Neuroengineering, Switzerland

Brain-Machine Interfaces (BMI) provide a direct communication link between brain and external devices such as speech synthesizers and robotic prosthesis to restore speech and movement in persons affected by Spinal Cord Injuries or neurodegenerative diseases such as Amyotrophic Lateral ... En savoir plus

Laser-Material Interaction Modeling using the COMSOL Multiphysics® software

E. C. Chevallier [1], V. Bruyère [1], P. Namy [1],
[1] SIMTEC, Grenoble, France

Surface engineering is a key technology used in a wide range of sectors in industry. Among other techniques, it involves adding functionality to a surface. This can be performed by creating a specific topography to a surface using laser texturing. The objective of the work presented in ... En savoir plus

Full Simulative Approach to Orbital Angular Momentum (OAM) Transmissions between Antenna Arrays

R. Gaffoglio [1], A. Cagliero [1], A. De Vita [2], B. Sacco [2],
[1] Department of Physics, University of Torino, Torino, Italy
[2] Centre for Research and Technological Innovation, RAI Radiotelevisione Italiana, Torino, Italy

The possibility of exploiting the Orbital Angular Momentum (OAM) of light as a means to simultaneously transmit radio signals at the same frequency led us to the experimental implementation of an OAM-based multiplexing scheme between antenna arrays. Within this framework, the realization ... En savoir plus

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