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Voyez comment la modélisation et la simulation sont utilisées par les industries La modélisation et la simulation multiphysiques pilotent l'innovation dans tous les grands secteurs d'activité et dans le monde universitaire — comme en témoignent les nombreuses utilisations présentées dans des articles et des posters techniques présentés par des ingénieurs, chercheurs et scientifiques à la Conférence COMSOL chaque année. Inspirez-vous des récents proceedings réunis ci-dessous, ou, pour trouver les présentations les plus intéressantes dans votre domaine d'intérêt, utilisez la recherche rapide.

Consultez les proceedings de la Conference COMSOL 2024

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Boston 2025

Terme recherché:

"solid mechanics"

Lagrangian Free Subduction Model Based on Viscoelastic Material using COMSOL Multiphysics®

J. Keum[1], B. So[1]
[1]Kangwon National University, Korea, Republic of

Subduction, the process through which the cold and dense oceanic lithosphere sinks into the highly viscous mantle, is the main driving force of plate tectonics and is important for recycling the Earth's materials. Active subduction has not been observed in any other planet in our solar ... En savoir plus

Actuation Force Study of Next Generation Micro Shutter Array for More Reliable Actuation

K. Kim[1], M. Li[2], A. Kutyrev[3], M. Greenhouse[2]
[1]NASA Goddard Space Flight Center/Science Systems and Applications Inc., USA
[2]NASA Goddard Space Flight Center, USA
[3]NASA Goddard Space Flight Center/University of Maryland College Park, USA

Micro shutter array (MSA) is a programmable optical spatial filtering device fabricated by micro electro-mechanical system (MEMS) technology. It was originally developed for James Webb Space Telescope (JWST) to enable multi-object spectroscopy and operated by a moving magnet. Next ... En savoir plus

Wire Bonding: A Thorough Numerical Methodology

Beatrice Carasi¹, Lucrezia Guarino¹, Lucia Zullino¹, Luca Cecchetto¹
¹STMicroelectronics

The semiconductor industry is always looking for early anticipation of manufacturing risk, pushing the development of Computer Aided Engineering (CAE) modeling of processes. Robust Chip-Package Interaction requires a deep understanding of thermo-mechanical stresses imposed during the ... En savoir plus

Thermomechanical Properties of Elastomeric Stamps for Micro-Transfer Printing Applications

C. Reyes¹, K. Oswalt ¹, J. Thostenson¹, J. Roe¹, D. Gomez¹
¹X-Celeprint, Durham, NC, USA

Micro-transfer printing (MTP) enables mass-transfer of wafer-level chips having lateral dimensions ranging from 3 x 7 um to 650 x 650 um to a nonnative substrate. This is accomplished with an elastomeric stamp containing micrometer scale posts that have been precisely defined using ... En savoir plus

Assessing the risk of cracking for wooden sculptures due to dynamic relative humidity changes

M. Sobon¹, L. Bratasz¹
¹Jerzy Haber Institute of Catalysis and Surface Chemistry, Poland

Wooden sculptures are an important part of European cultural heritage, but they are also among the most vulnerable objects to variations of temperature and relative humidity (RH). Fluctuations in the ambient environment can lead to irreversible structural and aesthetical damage. The ... En savoir plus

Fluid Structure Interaction of Arch Dam on Full Reservoir Level under Seismic Loading

R. Manikandan[1], R. Jayashiri [1], R. Indumathi [1], J. Archana [1],
[1] Dhirajlal Gandhi College of Technology, Salem, Tamil Nadu, India

The Finite Element Model is analyzed with impounded water considering appropriate boundary conditions between the water & the upstream face of the dam .The fluid on the upstream side is considered to be incompressible, inviscous, and irrotational. Here the effect of fluid ... En savoir plus

Multiphysics Modeling of High Power Magnetron

A. Jadhav[1], K. Tuckley[1], H. Dixit[2], J. John[1]
[1]IIT Bombay, India
[2]BITS Pilani, Hyderabad Campus, India

The magnetron is one of the oldest and the most popular of the vacuum tubes. As they are very robust, low cost and highly efficient source of high-power microwaves, they have been a common choice for defence, medical, industrial and commercial applications. This work presents the ... En savoir plus

Design and Simulation of a MEMS-Based Ultrasonic Transducer for Viscosity Sensing Applications

Rahul Goyal [1], Divya Mohan Yadav [1],
[1] Indian Institute of Science, Bangalore, Karnataka, India

Technologies based on micro electro mechanical systems (MEMS) present advantages for rheological applications as they enable the fabrication of smaller sensors with faster response times. In this work we propose fabrication parameters and simulation of a MEMS viscometer. This research ... En savoir plus

Periodic 3D Leaky SAW Simulations with 42 Y-cut Lithium Tantalate

S. Yandrapalli [1], V. Plessky [1],
[1] GVR Trade SA, Gorgier, Neuchatel, Switzerland

Introduction Leaky Surface Acoustic Wave (LSAW) resonators in rotated Y-X cut Lithium Tantalate (LiTaO3) are widely used for resonator based ladder filters in telecommunication applications. These devices make use of quasi- shear waves confined to the surface of the piezoelectric layer ... En savoir plus

Electrothermal Study of Cu-CNT Composite TSV Using COMSOL Multiphysics®

K. Sable[1], B. Kumari[2], M. Sahoo[3]
[1]M.Tech Scholar, Indian Institute of Technology Dhanbad., India
[2]SRF, Indian Institute of Technology Dhanbad., India
[3]Assistant Professor, Indian Institute of Technology Dhanbad., India

Modelling 3D IC structures with Through Silicon Vias (TSVs) and micro bumps is a promising technique to achieve “more than Moore” integration. Conventionally, Copper (Cu) is used as a TSV material. However, due to rapid scaling of interconnect, problems like electro-migration and surface ... En savoir plus

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