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Voyez comment la modélisation et la simulation sont utilisées par les industries La modélisation et la simulation multiphysiques pilotent l'innovation dans tous les grands secteurs d'activité et dans le monde universitaire — comme en témoignent les nombreuses utilisations présentées dans des articles et des posters techniques présentés par des ingénieurs, chercheurs et scientifiques à la Conférence COMSOL chaque année. Inspirez-vous des récents proceedings réunis ci-dessous, ou, pour trouver les présentations les plus intéressantes dans votre domaine d'intérêt, utilisez la recherche rapide.

Consultez les proceedings de la Conference COMSOL 2024

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Optimization of Extrusion Processes for non-Newtonian high-Viscous Fluids with Wall Slip and Shear Thinning Effects

W. Hoffmann[1], M. Scholz[1]
[1]SiCo-Solutions, Stuttgart, Germany

Simulation of the flow behaviour of non-Newtonian fluids with high viscosities leads to special material models with specific material parameters. In this presentation, a material model consisting of 4 material parameters describing the flow itself and also the wall slip is presented. ... En savoir plus

Thin Microchip Release From a Carrier Tape: Structural Mechanics and Vacuum Forces

S. Behler[1]
[1]Besi Switzerland AG, Switzerland

During semiconductor manufacturing, finished silicon microchips need to be released from a carrier tape they stick to by an adhesive. This is done by vacuum forces that (a) hold the chip flat from above and (b) pull the tape off from the chip underside. Sounds simple, but is very tricky ... En savoir plus

Flotation Height in 'Air Hockey' Spatial Atomic Layer Deposition

J. Grasso [1], B. Willis [1],
[1] Department of Chemical and Biomolecular Engineering, University of Connecticut, Storrs, CT, USA

Atomic layer deposition(ALD) is one proven method to deposit ultra-thin films. ALD is advantageous for its atomic-level thickness control and conformity; leading to high quality films. Slow deposition rates for conventional ALD contribute to the impracticality of utilization of this ... En savoir plus

MEMS-Based Microdroplet Generation with Integrated Sensing

P. Ben-Tzvi, and W. Rone
George Washington University
Washington, DC

This paper presents model development and simulation results for a microdroplet generator capable of internally measuring the volume of dispensed droplets. The system’s integrated sensing is enabled by storing compressible gas adjacent to the dispenser’s liquid reservoir. During ... En savoir plus

Using COMSOL Multiphysics^® for Biomechanical Analysis of Stent Technology in Cerebral Aneurysms

J. Rasmussen[1], M.S. Enevoldsen[1], J. Thyregod[2], and K-A. Henneberg[1]
[1]Department of Electrical Engineering, Technical University of Denmark, Kgs. Lyngby, Denmark
[2]COOK Medical Europe, Bjaeverskov, Denmark

This work presents new Fluid-Structure Interaction (FSI) models in both 2D and 3D of the effect of using vascular stents as treatment of cerebral berry aneurysms. The stent is positioned inside the cerebral artery covering the neck of the aneurysm. The stent is expected to alter the ... En savoir plus

FSI Analysis of Microcantilevers Vibrating in Fluid Environment

A. Ricci[1] and E. Giuri[1]

[1]Materials and Microsystems Laboratory (CHI-Lab), Politecnico di Torino, Torino, Italy

Cantilever vibration in fluid environment is probably one of the most common Fluid Structure Interaction problems in the field of Micro/Nano Electro Mechanical Systems. Usually the effect of fluid on cantilever oscillation is characterized in terms of mode resonance frequencies and ... En savoir plus

Simulation of the Self Assembly of a Microchip on a Structured Surface using the Phase Field Method

N. Boufercha, M. Ghahremanpour, M. Schnaithmann, J. Sägebarth, and H. Sandmaier
Universität Stuttgart / IFF-MST, Nobelstr.12, Stuttgart, Germany

The presented paper describes a method for micro precision assembly of very small objects like future microchips, which have a lateral expansion equal to or smaller than 500 μm. The modelling and simulation of a fluidicbased micro assembly method for a microchip with a dimension of ... En savoir plus

A Multi-Physics Framework for the Geometric Optimization of a Diaphragm Electrostatic Micropump

E. Bertarelli[1], R. Ardito[1], E. Bianchi[1], K. Laganà[1], A. Corigliano[1], G. Dubini[1], and R. Contro[1]

[1]Department of Structural Engineering, Politecnico di Milano, Milano, Italy

In this work, an electrostatic diaphragm micropump is investigated by means of COMSOL Multiphysics®. A fluid-dynamic model is adopted to evaluate the fluid flow characteristics inside the pumping chamber, in static conditions. In parallel, electromechanical quasi-static simulations ... En savoir plus

The Influence of Channel Aspect Ratio on Performance of Optimized Thermal-Fluid Structures

E.M. Dede
Toyota Research Institute of North America, Ann Arbor, MI, USA

Multiphysics optimization of thermal-fluid systems is an emerging area of interest with application to the development of high performance cooling technologies for electronic systems. This paper builds on previous work focused on the development of a computational platform for numerical ... En savoir plus

Using Computational Fluid Dynamics Model to Predict Changes in Velocity properties in Stented Carotid Artery

S. Vaidehi, and A. Ritter
Stevens Institute of Technolgy, Hoboken, NJ, USA

Atherosclerosis is a disease that narrows, thickens, hardens and restructures a blood vessel due to substantial plaque deposit. In the Carotid Artery, the decision to treat using endarterectomy and stenting is determined by the velocity as measured by Doppler flow in the common Carotid ... En savoir plus

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