Besi Improved Memory Chip Manufacturing with Multiphysics Simulation
Stefan Behler, Besi, Switzerland
As memory chips become smaller and smaller, designers must ensure that the chips stay intact during the manufacturing process. Besi develops equipment and assembly processes for substrate and wafer packaging production in markets such as consumer electronics, automotive, industrial, and solar energy. Stefan Behler, a senior expert process engineer, used multiphysics simulation to explore and optimize a new way of peeling off the tape on a memory chip that results in less deformation of the dies. This new method is now used by semiconductor packaging factories all over the world.
Suggested Stories
How Fast Do Elevated Temperatures Reach the Cell Interior?
Lithium-ion batteries, which have a tendency to degrade at high temperatures, must adhere to stringent regulations ...
Magnets Improve Quality of High-Power Laser Beam Welding
High-power laser beam welding uses a localized heat source to achieve narrow deep welds and high welding rates. ...
Floating on Sound Waves with Acoustic Levitation
As part of an industry that saves lives on a regular basis, pharmaceutical companies are in need of systems that can ...
Multiphysics Modeling in the Biopharma Industry
Amgen, a leading multinational biopharmaceutical company, produces various drug products that have treated serious ...
