BE CAE & Test Builds a Surface-Mount Device App for Thermal Analysis
Giuseppe Petrone, BE CAE & Test, Italy
BE CAE & Test, a COMSOL Certified Consultant, created a thermal model of a surface-mount device for a client and converted it into a simulation app with the Application Builder in COMSOL Multiphysics®, providing an interactive deliverable that could be used to investigate the system. Their clients are pleased to use an interactive tool with which they can investigate their system.
In the simulation app, the end user can vary the material of the solder layer and silicon die, thickness of the solder layer, and dissipated thermal power to examine the impact on maximum junction temperatures and junction-to-case thermal resistance.
Suggested Stories
Multiphysics Protects Wind Turbines when Lightning Strikes
Lightning Technologies, an NTS company, is a world leader in the design and validation of sophisticated lightning ...
Easy and Accurate Measurement of Blood Viscosity
Microvisk Technologies develops and manufactures devices for measuring blood viscosity using the power of Micro ...
Optimizing the Performance of Complex Building Façades
Engineers at Newtecnic specialize in complex building design, working with bold and fluid architectural shapes. To ...
Understanding the Origin of Uncertainty in Thermometer Calibration
Thermometers have widespread application and like any measurement device, they must be calibrated. Many do this with ...
