La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
An operational amplifier (op-amp) is a differential voltage amplifier with a wide range of applications in analog electronics. This tutorial models an op-amp connected to a feedback loop and a capacitive load. The op-amp is modeled as an equivalent linear subcircuit in the Electrical ... En savoir plus
This example of a dipole antenna array demonstrates a cost-effective analysis using the Boundary Element Method (BEM). When dealing with a large array made of metallic radiators, the Finite Element Method (FEM) would necessitate greater computational resources. The simulation results ... En savoir plus
Breaker and disconnector devices are widely used in AC substations in power systems.In this model, the Electrostatics Interface is used to simulate the electric potential and electric field in a 110kV 3-phase high-voltage switchgear operating at 50 Hz. A surrogate model is also trained ... En savoir plus
A time-varying current induces a time-varying magnetic field. The magnetic field induces currents in neighboring conductors. The induced currents are called eddy currents. In this model, the phenomenon is illustrated by a time-harmonic field simulation as well as a transient analysis, ... En savoir plus
The ball grid array (BGA) technology is a surface-mount technology widely used in electronic packaging. Usually, there are two types of solder balls considered in the array, including the functional balls that are required for electric connections and the support balls that are used only ... En savoir plus
HowTo: Using the EC External I-Terminal The External Couplings in the CIR interface has two flavors that can be used. External I vs. U and External I-terminal. The former has two nodes (it represents a differential external voltage measurement) and when coupling to an EC Terminal ... En savoir plus
In signal integrity (SI) applications, time-domain reflectometry (TDR) is a useful technique for analyzing the discontinuity in a signal path by observing the reflected signal strength. The reflected signal distorts the input pulse mainly by impedance mismatch if there is no external ... En savoir plus
Electron transport in low-temperature plasmas depends strongly on the electron energy distribution function (EEDF), which is often approximated as Maxwellian but is frequently nonequilibrium in reality. Incorporating nonequilibrium EEDF behavior into spatially dependent models often ... En savoir plus
This shows how a Gaussian beam incident on a periodic structure can be efficiently simulated. This could be applied to structured surfaces like metasurfaces or diffraction gratings. Because of superposition, only a single unit cell needs to be simulated. This can provide extremely ... En savoir plus
One method of creating spring-like structures or inducing curvature in thin structures is to plate them to substrates that are under the influence of residual stresses. The plating process can control this stress even for similar materials. One such device is the electrostatically ... En savoir plus
