La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
Droplet evaporation is ubiquitous in everyday life, and is essential in many industrial processes such as ink-jet printing, cleaning or coating of surfaces, and phase change heat transfer. In this model, a water droplet placed on a solid substrate evaporates in air. We solve the ... En savoir plus
This app demonstrates the following: Visualizing material appearance, color, and texture Showing info below the graphics about geometry parameters, results and performance depending on the selected plot action Thermoelectric coolers are widely used for electronics cooling in various ... En savoir plus
This model treats the free convection and heat transfer of a glass of cold water heated to room temperature. Initially, the glass and the water are at 5 °C and are then put on a table in a room at 25 °C. The nonisothermal flow is coupled to heat transfer using the Heat Transfer module. En savoir plus
This example models the casting process of a metal rod from liquid to solid state using the Non-Isothermal Flow multiphysics interface, which combines heat transfer and fluid flow. The model describes the fluid and solid flow and heat transport, including the phase transfer from melt to ... En savoir plus
The level set method is well suited for problems with moving boundaries in which the geometry’s topology changes with time. A bubble of oil that travels up through water and finally merges with oil at the top causes this kind of topology change. For problems where the topology is ... En savoir plus
All integrated circuits (ICs) — especially high-speed devices — produce heat. In today’s dense electronic system layouts, heat sources are many times placed close to heat-sensitive ICs. Designers of printed circuit boards often need to consider the relative placement of heat ... En savoir plus
The suite of models examine the air cooling of circuit boards populated with multiple integrated circuits (ICs), which act as heat sources. Two possible cooling scenarios are depicted: vertically aligned boards using natural convection, and horizontal boards with forced convection (fan ... En savoir plus
This example simulates 3D unsteady laminar flow past a cylinder in a channel. The inflow velocity profile is time-varying. The lift and drag coefficients are computed, and results show good agreement with those published in the literature. En savoir plus
Thermal management of a battery pack is simulated considering two scenarios, air (natural convection) and phase change material (PCM) in the gap between the batteries. The PCM considered is a composite material of paraffin wax and graphite additive. Graphite is typically added for ... En savoir plus
Double-pipe heat exchangers, with their typical U-turn shape, are one of the simplest and cheapest type of heat exchangers used in the chemical process industry. This example studies the cooling of hot oil (130°C) by a cool oil (60°C) entering in counter-current. As the oils flow ... En savoir plus