La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
A thin-walled metal frame with a central cutout, modeled using the Shell interface, is subjected to twisting and bending. Around the cutout the stresses are higher than the yield stress, thus the material undergoes plastic deformation over the loading history. En savoir plus
Creep is an inelastic time-dependent deformation which occurs when a material is subjected to stress at sufficiently high temperature, say 40% of the melting point or more. Experimental creep data (using constant stress and temperature) often display three different types of behavior ... En savoir plus
This model simulates the flow through a uniform inclined screen using the Screen feature in Single-Phase Flow physics and compares the results with an analytic solution. En savoir plus
The drive for miniaturizing electronic devices has resulted in today’s extensive use of surface-mount electronic components. An important aspect in electronics design and the choice of materials is a product’s durability and lifetime. For surface-mount resistors and other components ... En savoir plus
The present example simulates the turbulent flow over a 3D hill geometry using the Large Eddy Simulation (LES) interface with synthetic turbulence at the inlet boundary. En savoir plus
The electric shielding boundary condition is meant to approximate a thin layer of highly conductive material that provides an additional current path tangential to a boundary. This example compares the electric shielding boundary condition to a full-fidelity model and discusses the range ... En savoir plus
The contact impedance boundary condition is meant to approximate a thin layer of material that impedes the flow of current normal to the boundary, but does not introduce any additional conduction path tangential to the boundary. This example compares the contact impedance boundary ... En savoir plus
This is a benchmark model for an axisymmetric transient thermal analysis. The temperature on the boundaries changes from 0 degrees C to 1000 degrees C at the start of the simulation. The temperature at 190 s from the anlysis is compared with a NAFEMS benchmark solution. En savoir plus
This model couples the Navier Stokes equations and the heat transfer equations to examine density driven flow of free fluids. Here the fluid is in a square cavity with a heated wall. The buoyancy force is a Boussinesq term added to the Navier-Stokes equations. The equation is ... En savoir plus
In massive forming processes like rolling or extrusion, metal alloys are deformed in a hot solid state with material flowing under ideally plastic conditions. Such processes can be simulated effectively using computational fluid dynamics, where the material is considered as a fluid with ... En savoir plus