La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
This simple model demonstrates how to use the Semiconductor Optoelectronics interfaces to model a simple GaAs PIN diode structure. Both the stimulated and spontaneous emission in the semiconductor are accounted for. The corresponding absorption of the light and the associated change in ... En savoir plus
The modal dispersion in a metamaterial can be engineered by changing the type of material and dimension of the composing unit cells. For instance, a periodically organized subwavelength metal–dielectric layered metamaterial exhibits an anisotropic dispersion characteristic in the ... En savoir plus
This tutorial shows how to solve the full time-dependent wave equation in dispersive media such as plasmas and semiconductors. The 2D TM in-plane wave model solves for the vector potential from the wave equation and for an auxiliary electric polarization density from an ordinary ... En savoir plus
This model demonstrates the use of boundary element method in the Electromagnetic Waves, Boundary Element interface to model an optical Yagi-Uda antenna. The antenna is driven by an electrical point dipole, which is implemented through the background field. The field distribution around ... En savoir plus
Modeling curing is important in a wide variety of applications such as for devices utilizing polymer materials, rubber materials, plastics, and concrete. Curing is usually an exothermic reaction. In the current example, curing of butyl rubber is studied in a 3D mold for an automotive ... En savoir plus
The model includes a compilation of benchmark examples included in the text book: Shape Memory Alloys: Modeling and Engineering Applications. D. Lagoudas Ed. Springer 2008. The model uses the Souza–Auricchio model and shows the thermomechanical properties of a NiTi alloy sample ... En savoir plus
The contact impedance boundary condition is meant to approximate a thin layer of material that impedes the flow of current normal to the boundary, but does not introduce any additional conduction path tangential to the boundary. This example compares the contact impedance boundary ... En savoir plus
This 3D model example demonstrates the use of the Primary Current Distribution interface for modeling current distributions in electrochemical cells. In primary current distribution, the potential losses due to electrode kinetics and mass transport are assumed to be negligible, and ... En savoir plus
This app demonstrates the following: Parameterized geometries Visualizing material appearance, color, and texture Multiple plots in the same window to visualize the results Options to visualize the results with different views using check boxes Microstrip patch antenna arrays are ... En savoir plus
This model illustrates the instability of a space arc frame under concentrated vertical loading. The Beam interface is utilized. Two different approaches are used: A full incremental nonlinear analysis, where a small lateral load is applied to break the symmetry of the structure A ... En savoir plus
