La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
This model demonstrates how to use the Magnetic Fields, Currents Only interface together with the Stationary Source Sweep with Initialization study to compute the inductance matrix of PCB coils with a number of 12. En savoir plus
Reflow soldering is an important process in IC packaging. In reflow soldering, the solder materials are melted to create joints between electrical components and the PCBs for structural and electrical connections. This model demonstrates the process of attaching chips to a PCB by reflow ... En savoir plus
This model computes the lightning-induced voltage on an overhead line positioned above a lossy ground. It includes parameters like the inclination angle of lightning channels and soil conductivity, enabling straightforward analysis of their impacts. The calculated induced voltage aligns ... En savoir plus
These models demonstrate the usage of the user defined lumped port and lumped elements to introduce excitations and lumped circuit elements between volumetric conductors. Additional models show how to use impedance and transition boundary conditions to model the conductors, instead of ... En savoir plus
This tutorial explores how pulse reverse plating can be used as an additive-free alternative to attenuate small protrusions during copper metal deposition. By matching the process parameters, including the length of the forward and reverse pulses (duty cycles), a bright mirror-like metal ... En savoir plus
This model demonstrates the "butterfly" filling mechanism for copper electrodeposition in a Through-Hole (TH) via exposed to an electrolyte containing halide-suppressor additives. The Tertiary Current Distribution, Nernst Planck interface in combination with Deformed Geometry is used ... En savoir plus
This tutorial model explains how to extract lumped matrices by means of the Stationary Source Sweep study. The capacitance matrix of a five-terminal system is used to infer the position of a metallic object rather like real-world capacitive position sensors. The example illustrates the ... En savoir plus
Microlithography lenses are used to project the image of an integrated circuit onto a silicon substrate. This tutorial demonstrates how to create a 21-element fused silica lens which has a NA of 0.56 which is designed to be used at a wavelength of 248nm. The lens, which has a total ... En savoir plus
This model shows how to simulate a capacitively actuated surface micromachined accelerometer, using the Electromechanics Interface. It is based on a case study from the book Microsystem Design by Stephen D. Senturia (Kluwer Academic Publishers, 5th Edition, 2003, pages 513-525). En savoir plus
Silicon micromechanical resonators have long been used for designing sensors and are now becoming increasingly important as oscillators in the consumer electronics market. In this series of models, a surface micromachined MEMS resonator, designed as part of a micromechanical filter, is ... En savoir plus