La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
This tutorial shows how to solve the full time-dependent wave equation in dispersive media such as plasmas and semiconductors. The 2D TM in-plane wave model solves for the vector potential from the wave equation and for an auxiliary electric polarization density from an ordinary ... En savoir plus
This example demonstrates how an ESD event causes logic error of a microchip on a PCB board. The ESD current is based on the extended HBM (Human Body Model) and it is predefined in the Lumped Port feature. En savoir plus
This tutorial model demonstrates how to use the Combined Inductively/DC Discharge interface to simulate the plasma generated in a pulsed arc. This modeling technique is useful for a large range of industrial applications including cutting, welding, spraying, waste destruction, and ... En savoir plus
This model demonstrates how to couple the Semiconductor interface to the Heat Transfer in Solids interface. A thermal analysis is performed on the existing bipolar transistor model in the case when the device is operated in the active-forward configuration. The Semiconductor interface ... En savoir plus
This model demonstrates the "butterfly" filling mechanism for copper electrodeposition in a Through-Hole (TH) via exposed to an electrolyte containing halide-suppressor additives. The Tertiary Current Distribution, Nernst Planck interface in combination with Deformed Geometry is used ... En savoir plus
Electrochemical codeposition is a common low-cost method for producing metal alloys. This tutorial model demonstrates electrodeposition of a nickel (Ni)–phosphorous (P) alloy. The model accounts for charge and mass transport of a multitude of species along with multiple electrode ... En savoir plus
The present model example is based on Copper Deposition in a Trench model available in Electrodeposition Application Library. The nonuniform deposition along the trench surface leads to formation of a cavity/void. Since the Deformed Geometry interface cannot handle topological changes, ... En savoir plus
The electron energy distribution function (EEDF) plays an important role in the overall behavior of discharges. Analytic forms of the EEDF exist such as Maxwellian or Druyvesteyn, but in some cases they fail to fit the discharge physics. This tutorial model investigates the effects of ... En savoir plus
