La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
Surface micromachined thin films are often subject to residual stress. This COMSOL Multiphysics example describes a thin film resonator with straight or folded cantilever beam springs. The resonance frequencies of the resonator are affected by thermal stress. Using folded springs ... En savoir plus
A 3D model is used to simulate the cooling of a bevel gear from an austenitic state. Phase material properties and phase transformation data are imported into the model. The final phase composition and the residual stress state are computed. Phenomena such as thermal strains, phase ... En savoir plus
This model analyzes the operation of a micromirror in air and the effects of thermoviscous damping on the vibration response. The model includes thermal losses in the structure as well as thermoviscous acoustic phenomena. The model couples the Thermoelasticity multiphysics interface to ... En savoir plus
In massive forming processes like rolling or extrusion, metal alloys are deformed in a hot solid state with material flowing under ideally plastic conditions. Such processes can be simulated effectively using computational fluid dynamics, where the material is considered as a fluid with ... En savoir plus
This model serves the purpose of validation and verification of the Linear Elastic Material, Layered model in the Shell interface. In COMSOL Multiphysics, composites are analyzed either based on Layerwise 3D elasticity theory through the Layered Shell interface or based on FSDT-ESL ... En savoir plus
This model demonstrates how to set up a phase field damage multiphysics model to predict crack propagation in thermoelastic solids under large deformations. The crack-driving force depends on the principal stresses, which in turn depend on the temperature distribution in the solid ... En savoir plus
Reflow soldering is an important process in IC packaging. In reflow soldering, the solder materials are melted to create joints between electrical components and the PCBs for structural and electrical connections. This model demonstrates the process of attaching chips to a PCB by reflow ... En savoir plus
This model demonstrates an integrated structural-thermal-optical performance (STOP) analysis of an optical system. The Petzval Lens tutoral is used as the basis for this model, together with a simple barrel geometry The isothermal model performs a Parametric Sweep over several uniform ... En savoir plus
The following example solves a pure conduction and a free-convection problem in which a vacuum flask holding hot coffee dissipates thermal energy. The main interest is to calculate the flask's cooling power; that is, how much heat it loses per unit time. This tutorial model treats the ... En savoir plus
Modern integrated circuits are available as plastic encapsulated microcircuits (PEM). These devices are molded out of polymeric materials and epoxy resins in order to protect the internal semiconductors. Unfortunately, polymeric mold compounds absorb moisture when exposed to a humid ... En savoir plus