La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
This example shows how to use response spectrum analysis to verify the integrity of a structure that is exposed to an earthquake. The building is modeled as a steel frame, using beam elements. Displacements and stresses are computed. En savoir plus
Modern integrated circuits are available as plastic encapsulated microcircuits (PEM). These devices are molded out of polymeric materials and epoxy resins in order to protect the internal semiconductors. Unfortunately, polymeric mold compounds absorb moisture when exposed to a humid ... En savoir plus
This example demonstrates how to model coupled flow, heat transfer, and structural deformation and stress in a pipeline network. Gravity loads from the pipe and fluid are also taken into account. En savoir plus
This example demonstrates the wrinkling phenomenon in a thin sheet stretched uniaxially. The modified membrane theory, which incorporates the wrinkling model, ensures noncompressive principal stresses in the wrinkled region. The analytical results are compared to the numerical results. En savoir plus
This example shows how to set up self-contact for a coil spring. As the spring is compressed by a vertical force applied to one of its ends, it comes into to contact with itself and starts to rotate. En savoir plus
Reflow soldering is an important process in IC packaging. In reflow soldering, the solder materials are melted to create joints between electrical components and the PCBs for structural and electrical connections. This model demonstrates the process of attaching chips to a PCB by reflow ... En savoir plus
Many engineering structures consist of thin and slender components, where a full solid model will result in extremely many small elements. For such structures, it is much more efficient to use shell or beam elements. In this tutorial and verification model, it is shown how to connect ... En savoir plus
Sensitivity analysis is an efficient way of computing the gradient of an objective function with respect to many control variables. This example uses the pitch and yaw in the top of a truss tower as objective functions. It shows how to compute the sensitivity of these angles with respect ... En savoir plus
In this example, the homogenized elastic and thermal properties of a composite material based on a triply periodic minimal surface (TPMS) are computed. A gyroid TPMS-based unit cell is subjected to periodic boundary conditions to get the homogenized material properties. The effects of ... En savoir plus
Trusses are commonly used to create light structures that can support heavy loads. When designing such a structure, it is important to ensure its safety. For a tower made of bars, buckling can cause the structure to collapse. This model shows how to compute the critical buckling load ... En savoir plus