BE CAE & Test Builds a Surface-Mount Device App for Thermal Analysis
Giuseppe Petrone, BE CAE & Test, Italy
BE CAE & Test, a COMSOL Certified Consultant, created a thermal model of a surface-mount device for a client and converted it into a simulation app with the Application Builder in COMSOL Multiphysics®, providing an interactive deliverable that could be used to investigate the system. Their clients are pleased to use an interactive tool with which they can investigate their system.
In the simulation app, the end user can vary the material of the solder layer and silicon die, thickness of the solder layer, and dissipated thermal power to examine the impact on maximum junction temperatures and junction-to-case thermal resistance.
Suggested Stories
Using Multiphysics Simulation to Prevent Building Damage
In addition to surviving normal winters, a strong building must be able to survive the worst winters expected in a 50 ...
Optimizing Passenger Vehicle Design with Simulation Apps
The fast-paced passenger vehicle design process at Mahindra, a multinational automotive manufacturer, demands ...
Boeing Simulates Thermal Expansion in Composites with Expanded Metal Foil for Lightning Protection of Aircraft Structures
Carbon fiber composites are used extensively throughout the body of modern aircraft, such as the Boeing 787 ...
Investigating Vibroacoustic Properties in Moth Wings for Acoustic Camouflage
Researchers at the University of Bristol modeled the acoustic camouflaging properties of moth wing scales to gain a ...
