Disk-Stack Heat Sink

Application ID: 3576

This problem follows a typical preliminary board-level thermal analysis. First perform a simulation of the board with some Integrated Circuits (ICs). Then, add a disk-stack heat sink to observe cooling effects. Finally, explore adding a copper layer to the bottom of the board in order to even out the temperature distribution. This exercise highlights a number of useful modeling techniques such as combining 3D solids and shells and using thin layer boundary conditions in replacing 3D thin geometries by 2D boundaries.

Ce modèle a été construit avec les éléments suivants:

Heat Transfer Module