Quick Search

Electrodeposition on a Resistive Patterned Wafer

Application ID: 12361


This example models time-dependent copper deposition on a resistive wafer in a cupplater reactor. As the deposited layer builds up, the resistive losses of the deposited layer decreases. The benefit of using a current thief for a more uniform deposit is demonstrated.

Ce modèle a été construit avec les éléments suivants:

Electrodeposition Module

The combination of COMSOL® products required to model your application depends on the physics interfaces that define it. Particular physics interfaces may be common to several products (see the Specification Chart for more details). To determine the right combination of products for your project, you should evaluate all of your needs in light of each product\'s capabilities, consultation with the COMSOL Sales and Support teams, and the use of an evaluation license.