Electronic Chip Cooling

Application ID: 47721


This tutorial model uses a heat sink geometry from the Part Library. The tutorial shows different approaches to heat transfer modeling when studying the cooling of an electronic chip.

In the first part, only the solid parts are modeled, while the convective airflow is modeled using Convective Heat Flux boundary conditions.

In the second part, the model is extended to include a fluid domain for the flow channel to compute the coupled temperature and velocity of the fluid, assuming nonisothermal behavior.

In the last part, surface-to-surface radiation is considered to see how significantly it contributes to the results.

This model example illustrates applications of this type that would nominally be built using the following products:

Heat Transfer Module